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NVGS4141NT1G

P1-P3P4-P6
NTGS4141N, NVGS4141N
http://onsemi.com
4
TYPICAL PERFORMANCE CURVES
Figure 7. Capacitance Variation
Figure 8. Gate−To−Source and
Drain−To−Source Voltage vs. Total Charge
0.9
2
0
V
SD
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 9. Resistive Switching Time
Variation vs. Gate Resistance
I
S
, SOURCE CURRENT (AMPS)
V
GS
= 0 V
T
J
= 25°C
0.40
7
Figure 10. Diode Forward Voltage vs. Current
0.80.6
5
6
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
200
1200
10 0 5 105
T
J
= 25°C
C
iss
C
oss
C
rss
15 20 25
0
400
600
C
iss
C
rss
V
DS
= 0 V V
GS
= 0 V
V
DS
V
GS
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
0
4
0
Q
G
, TOTAL GATE CHARGE (nC)
10
8
I
D
= 7 A
V
DD
= 15 V
T
J
= 25°C
V
GS
Q
GS
R
G
, GATE RESISTANCE (OHMS)
1 10 100
1000
10
t, TIME (ns)
V
DD
= 24 V
I
D
= 7 A
V
GS
= 10 V
t
r
t
d(on)
t
f
t
d(off)
Q
GD
QT
1
4
800
150
0
T
J
, STARTING JUNCTION TEMPERATURE (°C)
EAS, SINGLE PULSE DRAIN−TO−SOURCE
AVALANCHE ENERGY (mJ)
I
D
= 10.4 A
60
10025
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
12575
40
20
6
2
121024 68
0.2
50
1000
100
1
3
0.3 0.70.50.1
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
0.1 1 100
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
0.01
100
R
DS(on)
LIMIT
THERMAL LIMIT
PACKAGE LIMIT
10
10
0 V ≤ V
GS
≤ 20 V
SINGLE PULSE
T
C
= 25°C
1 ms
100 ms
dc
0.1
1
10 ms
10 ms
I
D
, DRAIN CURRENT (AMPS)
NTGS4141N, NVGS4141N
http://onsemi.com
5
TYPICAL PERFORMANCE CURVES
2.5
2.25
2.0
1.75
1.5
1.25
1.0
0.75
0.5
0.25
0
0 20 40 60 80 100 120 140 160
T
A
, AMBIENT TEMPERATURE (°C)
P
D
, POWER DISSIPATION (W)
Figure 13. Maximum Power Derating Chart
References is T
J
-
max
= 150°C
R
q
JA
, t < 10 s, 1 sq in
R
q
JA
, 1 sq in
R
q
JA
, min pad
T
A
, AMBIENT TEMPERATURE (°C)
P
D
, POWER DISSIPATION (W)
Figure 14. Current Derating Chart
8.0
0 20 40 60 80 100 120 140 16
0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
References is T
J
-
max
= 150°C
R
q
JA
, t < 10 s, 1 sq in
R
q
JA
, 1 sq in
R
q
JA
, min pad
0.01
1000
0.01 0.1 1 10 100 1000
10
D = 0.5
R
thja(t)
, TRANSIENT THERMAL RESPONSE (°C/W)
Figure 15. Thermal Response
0.2
0.1
0.05
0.02
0.01
Single Pulse
t, PULSE TIME (s)
1
0.1
0.00001 0.0001 0.0010.000001
100
Table 1. ORDERING INFORMATION
Part Number
Marking
(XX)
Package Shipping
†
NTGS4141NT1 S4 TSOP−6 3000 / Tape & Reel
NTGS4141NT1G S4 TSOP−6
(Pb−Free)
3000 / Tape & Reel
NVGS4141NT1G VS4 TSOP−6
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NTGS4141N, NVGS4141N
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
23
456
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX
MILLIMETERS
0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
e 0.85 0.95 1.05
L 0.20 0.40 0.60
0.25 BSC
L2
−
0° 10°
1.30 1.50 1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
DETAIL Z
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M
ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NTGS4141N/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
P1-P3P4-P6

NVGS4141NT1G

Mfr. #:
Buy NVGS4141NT1G
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET TSOP6 30V 7A 0.030R
Lifecycle:
New from this manufacturer.
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