1998 Feb 09 7
Philips Semiconductors Preliminary specification
Octal Low Side Driver (OLSD) TJA1010
THERMAL CHARACTERISTICS
Notes
1. Printed on an FR-4 board with minimum foot print.
2. Power uniformly divided over all outputs.
CHARACTERISTICS
T
j
= 40 to +135 °C; V
DD
= 11 to 13.5 V; V
bat(max)
=V
DD
+ 1.5 V. All voltages are defined with respect to ground.
Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100%
tested at T
amb
=25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th (j-amb)
from junction to ambient in free air note 1 55 K/W
R
th (j-sp)
from junction to soldering point of ground pins
6 to 9 and 20 to 23
note 2 17 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DD
supply current I
o
= 0 mA; V
STBY
>3V −−5mA
V
STBY
<1V; V
DD
=13V;
T
j
=40 to +85 °C
−−10 µA
V
DD(UV)
undervoltage shutdown threshold 2 4.3 V
V
DD(0V)
overvoltage protection threshold 25 33 V
V
o(clamp)
output clamp voltage I
o
=20mA 506070V
I
LO
output leakage current
(one output)
off-state, V
o
= 13 V; standby 10 µA
off-state, V
o
=13V;
operational
70 210 µA
off-state, V
o
=1V;
operational
40 180 µA
I
o(lim)
output current limit (one output) on-state 0.3 0.55 A
R
o
output resistance (one output) I
o
= 0.2 A; V
DD
=13V;
T
j
= 135 °C
−−3
I
o
= 0.2 A; V
DD
=13V;
T
j
=25°C
−−2.5
I
o
= 0.1 A; V
DD
= 5.5 V;
see Fig.6
−−10
V
ref
open load/short-circuit reference
voltage
note 1 1 1.9 V
δI
o
/δt maximum rise and fall time of
output current
V
DD
=13V; R
L
= 100 ;
note 2
−−100 mA/µs
V
IH
HIGH-level input voltage at pins
SI, SCL, SIE and STBY
3 −−V
V
i(hys)
input voltage hysteresis at pins
SI, SCL and SIE
note 2 0.2 1.2 V
V
IL
LOW-level input voltage at pins
SI, SCL and SIE
−−0.8 V
V
IL(STBY)
LOW-level input voltage at pin
STBY
−−1V
1998 Feb 09 8
Philips Semiconductors Preliminary specification
Octal Low Side Driver (OLSD) TJA1010
Notes
1. Open load is indicated for V
o
<V
ref
in the off-state, short-circuited load is indicated for V
o
>V
ref
in the on-state.
2. Guaranteed by design.
3. Delay caused by load excluded.
I
i
input current at pins SCL and SIE V
i
=3V 20 60 µA
I
LI
input leakage current at pins SI,
SIE and SCl
off-state; V
i
=3V;
T
j
=85°C; V
STBY
<1V
−−5µA
R
i(STBY)
input resistance at pin STBY V
i
=1V; T
j
<85°C40150 k
I
i(STBY)
input current at pin STBY V
i
=3V 20 60 µA
V
STAT(L)
status LOW voltage I
STAT(L)
= 1.6 mA −−0.4 V
V
SO(L)
serial output LOW voltage I
SO
= 1.6 mA −−0.4 V
I
LO(SO)
output leakage current at pin SO
and status outputs
off-state; V
o
=5V;
V
STBY
<1V; T
j
<85°C
−−10 µA
f
clk
clock frequency −−1 MHz
t
W(SCL)
SCL positive pulse width HIGH-to-LOW transition 500 −−ns
t
d(SIE-SCL)
delay time from SIE HIGH to SCL
LOW
100 −−ns
t
su(SIE-SCL)
set-up time from SIE LOW to SCL
HIGH
250 −−ns
t
d(SCL-SO)
delay time from SCL HIGH to SO
valid
note 3 −−250 ns
t
su(SI-SCL)
set-up time from SI to falling edge
of SCL
150 −−ns
t
h(SCL-SI)
hold time from falling edge of SCL
to SI
150 −−ns
t
h(SCL-SIE)
hold time from SCL LOW to SIE
HIGH
250 −−ns
t
su(STBY)
STBY set-up time from STBY
HIGH to SIE LOW
100 −−µs
t
h(STBY)
STBY hold time from SIE HIGH to
STBY LOW
10 −−µs
t
d(STAT)
delay time for status pin enable 40 100 250 µs
T
th(otc)
threshold overtemperature control 170 −°C
T
th(ets)
threshold emergency temperature
shutdown
190 −°C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1998 Feb 09 9
Philips Semiconductors Preliminary specification
Octal Low Side Driver (OLSD) TJA1010
Fig.3 Serial interface timing.
(1) Inverting only when error (open load/short-circuit).
handbook, full pagewidth
MBH992
D1
new
B
n
+
1
(1)
D3
new
D2
new
D4
new
D5
new
D6
new
D7
new
D8
new
D1
old
previous
D8
D3
old
D2
old
D4
old
D5
old
D6
old
D7
old
D8
old
corresponding to D1 new
corresponding to D8 new
corresponding to D1 oldOUT1
SO
SI
SCL
SIE
shift
register
bit n
OUT2 corresponding to D8 old

TJA1010T/N1,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC OCTAL LOW SIDE DRVR 28SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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