3
IDTQS4A105
HIGH-PERFORMANCE CMOS TWO-CHANNEL 4PST SWITCH
INDUSTRIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Industrial: TA = –40°C to +85°C, VCC = 5V ± 5%
POWER SUPPLY CHARACTERISTICS
Symbol Parameter Test Conditions Max. Unit
ICC Supply Current VCC = Max., VIN = GND or VCC 3 μA
Symbol Parameter Test Conditions Min. Typ.
(1)
Max. Unit
Analog Switch
VIN Analog Signal Range
(2)
0 — Vcc - 1 V
r
DS(ON) Drain-source ON resistance
(2,3)
Vcc = Min., VIN = 0V, ION = 30mA — 5 7 Ω
Vcc = Min., VIN = 2.4V, ION = 15mA — 13 17
IC(OFF) Channel Off Leakage Current Ax, Bx = Vcc or 0V, Cx, Dx = 0V or Vcc, E = Vcc — 1 — nA
I
C(ON) Channel On Leakage Current Ax = Bx = Cx = Dx = 0V — 1 — nA
(each channel is turned on sequentially)
Digital Control
VIH Input HIGH Voltage Guaranteed Logic HIGH for Control Pins 2 — — V
VIL Input LOW Voltage Guaranteed Logic LOW for Control Pins — — 0.8 V
Dynamic Characteristics
t
ON(E) Enable Turn-On Time RL = 1KΩ, CL = 100pF 0.5 — 6.5 ns
E to Ax, Bx, Cx, or Dx (See Switching Time)
tOFF(E) Enable Turn-Off Time RL = 1KΩ, CL = 100pF 0.5 — 6 ns
E to Ax, Bx, Cx, or Dx (See Switching Time)
tPD Group Delay
(2,4a)
RL = 1KΩ, CL = 100pF — — 250 ps
f3dB -3dB Bandwidth VIN = 0 to 1V, 1Vp-p, RL = 75Ω — 1.3 — GHz
Off-isolation VIN = 0 to 1V, 1Vp-p, RL = 75Ω, f = 5.5MHz — -60 — dB
XTALK Crosstalk VIN = 1Vp-p, RL = 75Ω, f = 5.5MHz — -70 — dB
C(OFF) Mux Off Capacitance E = Vcc, VIN = VOUT = 0V — 5 — pF
C(ON) Mux On Capacitance E = 0V, VIN = VOUT = 0V — 10 — pF
Q
CI Charge Injection CL = 1000pF — 1.5 — pC
NOTES:
1. Typical values are at VCC = 5.0V, TA = 25°C.
2. Max value is guaranteed but not production tested.
3. Measured by voltage drop between A and C pins or B and D pins at indicated current through the switch. ON resistance is determined by the lower of the voltages on the
two (A, C, or B, D) pins.
4. The bus switch contributes no group delay other than the RC delay of the ON resistance of the switch and load capacitance. Group delay of the bus switch, when used
in a system, is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.
