LQP03TN8N2J02D Datasheet LQP03TN0N9C02D, LQP03TN2N1B02D, LQP03TN1N3C02D | P7-P9

Spec No.JELF243C-0015T-01 P.7/12

MURATA MFG.CO., LTD

Reference Only

9.Environmental Performance

It shall be soldered on the substrate.

No. Item Specification Test Method

9.1 Heat Resistance Appearance:No damage

Inductance Change: within ±10%

Substrate:Glass-epoxy substrate

Temperature:125°C

Time:1000h (+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

9.2 Cold Resistance Substrate:Glass-epoxy substrate

Temperature:-55°C

Time:1000 h (+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

9.3 Humidity Substrate:Glass-epoxy substrate

Temperature:40°C±2°C

Humidity:90%(RH) to 95%(RH)

Time:1000 h(+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

9.4 Temperature

Cycle

Substrate:Glass-epoxy substrate

1 cycle:

1 step: -55°C / 30min±3 min

2 step:Ordinary temp. / 10~15 min

3 step: 125°C / 30min±3 min

4 step: Ordinary temp. / 10~15 min

Total of 10 cycles

Then measured after exposure in the

room condition for 24h±2h.

10.Specification of Packaging

10.1 Appearance and Dimensions of paper tape (8mm-wide)

(in mm)

10.2 Specification of Taping

(1) Packing quantity (standard quantity)

15,000 pcs. / reel

(2) Packing Method

Products shall be packed in the cavity of the base tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Base tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,

and are not continuous. The Specified quantity per reel is kept.

2.0±0.05

Polarity

Marking

2.0±0.05

4.0±0.1

φ1.5

+0.1

-0

0.35±0.03

Direction of feed

0.55 max.

1.75±0.1

3.5±0.05

8.0±0.2

※A

※A 0N6～62N、R13～R27； 0.67±0.03

68N～R12； 0.65±0.03

Spec No.JELF243C-0015T-01 P.8/12

MURATA MFG.CO., LTD

Reference Only

10.3 Pull Strength

Cover tape 5N min

10.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force

0.1N to 0.6N

(minimum value is typical)

10.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.

(in mm)

10.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1) ,

RoHS Marking (∗2),

Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) <Expression of RoHS Marking> ROHS – Y (△)

(1) (2)

(1)

RoHS regulation conformity parts.

(2) MURATA classification number

10.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking (∗2) ,Quantity, etc ･･･

10.8 Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity

in Outer Case (Reel)

W D H

186 186 93 5

∗ Above Outer Case size is typical. It depends on a quantity of an order.

Cover tape

Base tape

165

to 180

゜

Empty tape

190 min.

Leader

Trailer

2.0±0.5

13.0±0.2

21.0±0.8

180

9.0

13.0±1.4

-3

Direction of feed

210 min.

160 min.

Cover tape

-0

Label

Spec No.JELF243C-0015T-01 P.9/12

MURATA MFG.CO., LTD

Reference Only

11. ！ Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment (8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

12. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

12.1 Land pattern designing

a 0.2~0.3

b 0.8~0.9

c 0.2~0.3

(in mm)

12.2 Flux, Solder

・ Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・ Use Sn-3.0Ag-0.5Cu solder.

・ Standard thickness of solder paste : 100μm~150μm.

12.3 Reflow soldering conditions

・ Pre-heating should be in such a way that the temperature difference between solder and

product surface is limited to 150°C max. Cooling into solvent after soldering also should be

in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of

products quality.

・ Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

・Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150°C～180°C 、90s±30s

Heating above 220°C､30s～60s above 230°C､60s max.

Peak temperature 245°C±3°C 260°C,10s

Cycle of reflow 2 times 2 times

Chip Coil

Solder resist

Land

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

P1-P3 P4-P6 P7-P9 P10-P12

LQP03TN8N2J02D

Mfr. #:

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Fixed Inductors 8.2nH 5% 500MHz

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LQP03TN8N2J02D

LQP03TN8N2J02D

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