NVMFS5C410NWFT3G

© Semiconductor Components Industries, LLC, 2016
February, 2017 Rev. 2
1 Publication Order Number:
NVMFS5C410N/D
NVMFS5C410N
Power MOSFET
40 V, 0.92 mW, 300 A, Single NChannel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NVMFS5C410NWF Wettable Flank Option for Enhanced Optical
Inspection
AECQ101 Qualified and PPAP Capable
These Devices are PbFree and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DraintoSource Voltage V
DSS
40 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 3)
Steady
State
T
C
= 25°C
I
D
300
A
T
C
= 100°C 212
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C
P
D
166
W
T
C
= 100°C 83
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
46
A
T
A
= 100°C 32
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.9
W
T
A
= 100°C 1.9
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
900 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+ 175
°C
Source Current (Body Diode) I
S
158 A
Single Pulse DraintoSource Avalanche
Energy (I
L(pk)
= 34 A)
E
AS
578 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase Steady State
R
q
JC
0.9
°C/W
JunctiontoAmbient Steady State (Note 2)
R
q
JA
39
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surfacemounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
XXXXXX
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
40 V
0.92 mW @ 10 V
300 A
G (4)
S (1,2,3)
NCHANNEL MOSFET
D (5,6)
S
S
S
G
D
D
D
D
DFN5
(SO8FL)
CASE 488AA
STYLE 1
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
XXXXXX = 5C410N
XXXXXX = (NVMFS5C410N) or
XXXXXX = 410NWF
XXXXXX = (NVMFS5C410NWF)
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
1
NVMFS5C410N
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
40 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
5
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 40 V
T
J
= 25 °C 10
mA
T
J
= 125°C 100
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
2.5 3.5 V
Threshold Temperature Coefficient V
GS(TH)
/T
J
8.6 mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V I
D
= 50 A 0.76 0.92
mW
Forward Transconductance g
FS
V
DS
=15 V, I
D
= 50 A 190 S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
6100
pF
Output Capacitance C
OSS
3400
Reverse Transfer Capacitance C
RSS
70
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 32 V; I
D
= 50 A 86
nC
Threshold Gate Charge Q
G(TH)
V
GS
= 10 V, V
DS
= 32 V; I
D
= 50 A
18
GatetoSource Charge Q
GS
28
GatetoDrain Charge Q
GD
14
Plateau Voltage V
GP
4.9 V
SWITCHING CHARACTERISTICS (Note 5)
TurnOn Delay Time
t
d(ON)
V
GS
= 10 V, V
DS
= 32 V,
I
D
= 50 A, R
G
= 2.5 W
54
ns
Rise Time t
r
162
TurnOff Delay Time t
d(OFF)
227
Fall Time t
f
173
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 50 A
T
J
= 25°C 0.8 1.2
V
T
J
= 125°C 0.65
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 50 A
91
ns
Charge Time t
a
42
Discharge Time t
b
49
Reverse Recovery Charge Q
RR
159 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
NVMFS5C410N
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3
TYPICAL CHARACTERISTICS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE VOLTAGE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
3.01.51.00.50
0
40
80
160
120
200
743210
0
50
100
150
300
Figure 3. OnResistance vs. GatetoSource
Voltage
Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATETOSOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
109876543
0
1.0
4.0
200 250150100500
0.50
0.60
0.75
1.00
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE VOLTAGE (V)
150125100752502550
1.0
1.2
1.4
1.6
1.8
2.0
40353025155
1.E07
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAINTO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (A)
4.4 V
4.8 V
10 V to 6.0 V
T
J
= 125°C
T
J
= 25°C
T
J
= 55°C
T
J
= 25°C
I
D
= 50 A
T
J
= 25°C
V
GS
= 10 V
V
GS
= 10 V
I
D
= 50 A
50 175
T
J
= 125°C
T
J
= 85°C
240
280
200
250
2.0 2.5
3.0
0.5
2.0
5.0
3.5
0.55
0.70
0.80
0.8
1.E06
10 20
T
J
= 150°C
56
0.85
0.95
V
GS
= 4.0 V
5.2 V
V
DS
= 10 V
1.5
2.5
4.5
0.65
0.90
1.E05
1.E04
1.E03

NVMFS5C410NWFT3G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET T6-D3F 40V NFET
Lifecycle:
New from this manufacturer.
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