SDMG0340L /LA /LC /LS
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable Per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe)
• Terminal Connections: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
Top View SDMG0340L SDMG0340LA SDMG0340LC SDMG0340LS
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
SDMG0340L /LA /LC /LS
Document number: DS30248 Rev. 12 - 2
1 of 4
www.diodes.com
July 2008
© Diodes Incorporated
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
40 V
RMS Reverse Voltage
V
R(RMS)
28 V
Forward Continuous Current (Note 1)
I
FM
30 mA
Non-Repetitive Peak Forward Surge Current @ t = 8.3ms
I
FSM
200 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
200 mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θ
JA
625
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-40 to +125
°C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
40
⎯ ⎯
V
I
R
= 10μA
Forward Voltage
V
F
⎯
295 370 mV
I
F
= 1.0mA
Leakage Current (Note 2)
I
R
⎯
150 1000 nA
V
R
= 10V
Total Capacitance
C
T
⎯
2.0
⎯
pF
V
R
= 1V, f = 1.0MHz
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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