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CMH08(TE12L,Q,M)

P1-P3P4-P5
CMH08
2013-11-01
1
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH08
Switching Mode Power Supply Applications
• Repetitive peak reverse voltage: V
RRM
= 400 V
• Average forward current: I
F (AV)
= 2.0 A
• Low forward voltage: V
FM
=1.3 V(Max.)
• Very fast reverse recovery time: trr =50ns(Max.)
• Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
RRM
400 V
Average forward current I
F (AV)
2.0 (Note 1) A
Peak one cycle surge forward current
(non-repetitive)
I
FSM
30 (50 Hz) A
Junction temperature T
j
−40~150 °C
Storage temperature range T
stg
−40~150 °C
Note 1: Tℓ＝110°C Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness:0.64t
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
V
FM (1)
I
FM
= 0.1 A (pulse test) ⎯ 0.77 ⎯
V
FM (2)
I
FM
= 1.0 A (pulse test) ⎯ 0.98 ⎯
Peak forward voltage
V
FM (3)
I
FM
= 2.0 A (pulse test) ⎯ 1.1 1.3
V
Peak repetitive reverse current I
RRM
V
RRM
= 400 V (pulse test) ⎯ ⎯ 10 μA
Reverse recovery time t
rr
I
F
= 1 A, di/dt = −30 A/μs ⎯ ⎯ 50 ns
Forward recovery time t
fr
I
F
= 1.0 A ⎯ ⎯ 100 ns
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
⎯ ⎯ 60
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
⎯ ⎯ 135
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯ ⎯ 210
°C/W
Thermal resistance
(junction to lead)
R
th (j-ℓ)
⎯
⎯ ⎯ 16 °C/W
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 3-4E1A
Weight: 0.023 g (typ.)
Start of commercial production
2002-12
CMH08
2013-11-01
2
Marking
Abbreviation code Part No.
H8 CMH08
Standard Soldering Pad
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when you
design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV).
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using
an allowable Tamax-IF (AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
3.0 1.4
2.1
Unit: mm
1.4
CMH08
2013-11-01
3
Average forward current I
F (AV)
(A)
Tℓ max – I
F (AV)
Maximum allowable lead temperature
Tℓ max (°C)
Average forward current I
F (AV)
(A)
P
F (AV)
– I
F (AV)
Average forward power dissipation
P
F (AV)
(W)
0
0
0.4
1.0
0.2 0.4 0.6 0.8 1.0 2.2
0.2
0.6
0.8
160
60
0
20
40
80
100
120
140
Instantaneous forward voltage v
F
(V)
i
F
– v
F
Instantaneous forward current i
F
(A)
0.4
0.01
1
100
0.8 1.2 1.6 2.0
150°C
T
j
= 25°C
75°C
0.1
10
1.2 1.4
1.2
1.4
2.2
0.2 0 0.4 0.6 1.0 0.8 1.2 1.4
2.2
Pulse test
Average forward current I
F (AV)
(A)
Ta max – I
F (AV)
Maximum allowable ambient temperature
Ta max (°C)
160
60
0
20
40
80
100
120
140
1000
1
100
10
0.001 1000 0.01 0.1 100 10 1
3
5
30
50
300
500
0.003 0.03 0.3 3 30 300
Transient thermal impedance
r
th (j-a)
(°C/W)
Time t (s)
r
th (j-a)
– t
2.4 2.0
1.6
1.6 1.8
1.8
2.0
1.6 1.8 2.0
0.2 0 0.4 0.6 1.0 0.8 1.2 1.4
2.2
1.6 1.8 2.0
360°
0°
180°
Rectangular
Waveform
360°
0°
180°
Rectangular
Waveform
360°
0°
180°
Rectangular
Waveform
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 t
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
P1-P3P4-P5

CMH08(TE12L,Q,M)

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Description:
Rectifiers 400 Vrrm 2.0A IF 1.3V VFM 30A IFSM
Lifecycle:
New from this manufacturer.
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