AOWF9N70

AOWF9N70
700V,9A N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 9A
R
DS(ON)
(at V
GS
=10V) < 1.2
100% UIS Tested
100% R
g
Tested
Symbol
V
DS
The AOWF9N70 is fabricated using an advanced high
voltage MOSFET process that is designed to deliver high
levels of performance and robustness in popular AC-DC
applications.By providing low R
DS(on)
, C
iss
and C
rss
along
with guaranteed avalanche capability this parts can be
adopted quickly into new and existing offline power supply
designs.
V
UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
800V@150
Drain-Source Voltage
AOWF9N70
700
G
D
S
Top View
TO-262F
Bottom View
G
D
S
G
D
S
AOWF9N70
V
GS
I
DM
I
AR
E
AR
E
AS
Peak diode recovery dv/dt dv/dt
T
J
, T
STG
T
L
Symbol
R
θ
JA
R
θJC
* Drain current limited by maximum junction temperature.
4.5
3.2
°C/W
AOWF9N70 Units
A
°C
mJ
W
W/
o
°C/W65
300
-55 to 150
Maximum Junction-to-Ambient
A,D
°C
P
D
V/ns
mJ
V±30Gate-Source Voltage
9*
5.8*
T
C
=100°C
A
33Pulsed Drain Current
C
Continuous Drain
Current
T
C
=25°C
I
D
Maximum Junction-to-Case
28
0.22
Avalanche Current
C
77
Single pulsed avalanche energy
G
154
Parameter
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Junction and Storage Temperature Range
Derate above 25
o
C
Repetitive avalanche energy
C
T
C
=25°C
Thermal Characteristics
5
Power Dissipation
B
Rev0: Dec 2011
www.aosmd.com Page 1 of 5
AOWF9N70
Symbol Min Typ Max Units
700
800
BV
DSS
/
TJ
0.84
V/
o
C
1
10
I
GSS
Gate-Body leakage current
±100
nΑ
V
GS(th)
Gate Threshold Voltage
3 3.9 4.5 V
R
DS(ON)
0.94 1.2
g
FS
10 S
V
SD
0.74 1 V
I
S
Maximum Body-Diode Continuous Current 9 A
I
SM
33 A
C
iss
1085 1357 1630 pF
C
oss
90 113 147 pF
C
rss
6 7.4 11 pF
R
g
2 4 6
Q
g
23 28.5 35 nC
Q
gs
6.8 nC
Q
gd
11.6 nC
t
D(on)
35 ns
t
r
61 ns
t
D(off)
76 ns
V
DS
=5V,
I
D
=250µA
V
DS
=560V, T
J
=125°C
V
DS
=0V, V
GS
30V
V
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
I
D
=250µA, V
GS
=0V, T
J
=150°C
Zero Gate Voltage Drain Current ID=250µA, VGS=0V
Maximum Body-Diode Pulsed Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
Turn-Off DelayTime
V
GS
=10V, V
DS
=350V, I
D
=9A,
R
G
=25
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Total Gate Charge
V
GS
=10V, V
DS
=560V, I
D
=9A
DYNAMIC PARAMETERS
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
DSS
Zero Gate Voltage Drain Current
V
DS
=700V, V
GS
=0V
µA
BV
DSS
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=4.5A
Reverse Transfer Capacitance
V
GS
=0V, V
DS
=25V, f=1MHz
SWITCHING PARAMETERS
I
S
=1A,V
GS
=0V
V
DS
=40V, I
D
=4.5A
Forward Transconductance
Turn-On Rise Time
Gate Source Charge
Gate Drain Charge
Diode Forward Voltage
D(off)
t
f
48 ns
t
rr
300 375
450 ns
Q
rr
6 7.5
9
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Charge
I
F
=9A,dI/dt=100A/µs,V
DS
=100V
Turn-Off Fall Time
Body Diode Reverse Recovery Time
I
F
=9A,dI/dt=100A/µs,V
DS
=100V
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial
T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedance from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
G. L=30mH, I
AS
=3.2A, V
DD
=150V, R
G
=25, Starting T
J
=25°C
Rev0: Dec 2011 www.aosmd.com Page 2 of 5
AOWF9N70
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
3
6
9
12
15
18
0 5 10 15 20 25 30
I
D
(A)
V
DS
(Volts)
Fig 1: On-Region Characteristics
V
GS
=5.5V
6V
10V
6.5V
0.1
1
10
100
2 4 6 8 10
I
D
(A)
V
GS
(Volts)
Figure 2: Transfer Characteristics
-
55
°
C
V
DS
=40V
25
°
C
125
°
C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 4 8 12 16 20
R
DS(ON)
(
)
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Normalized On-Resistance
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
V
GS
=10V
I
D
=4.5A
40
1E-04
1E-03
1E-02
1E-01
1E+00
1E+01
1E+02
0.0 0.2 0.4 0.6 0.8 1.0
I
S
(A)
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
25°C
125
°
C
Voltage
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
BV
DSS
(Normalized)
T
J
C)
Figure 5:Break Down vs. Junction Temparature
Rev0: Dec 2011 www.aosmd.com Page 3 of 5

AOWF9N70

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 700V 9A TO262F
Lifecycle:
New from this manufacturer.
Delivery:
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