LQH43PH221M26L

Spec No.JELF243A-9137D-01 P4/8
MURATA MFG.CO., LTD
Reference Only
8.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
8.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(
1), RoHS marking(
2), Quantity etc
・・・
1) <Expression of Inspection No.>
□□
OOOO
×××
(1)
(2) (3
)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y (
)
(1)
(2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
2) ,Quantity, etc
・・・
8.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 4
Above Outer Case size is typical. It depends on a quantity of an order
165 to 180 degree
F
Cover tape
Plastic tape
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
1
0
17.0±1.4
φ
180±
0
3
13.
1
0
(in mm)
Trailer : 160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
W
D
Label
H
Spec No.JELF243A-9137D-01 P5/8
MURATA MFG.CO., LTD
Reference Only
4.5
1.2
0.3
7.5
1.5
2.1
2.8
1.5
1.5
1.5
9. Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Transportation equipment (trains, ships, etc.)
(4) Power plant control equipment (9) Applications of similar complexity and /or reliability
(5) Medical equipment requirements to the applications listed in the above
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second
damage that may be caused by the abnormal function or the failure of our product.
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
10.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
Spec No.JELF243A-9137D-01 P6/8
MURATA MFG.CO., LTD
Reference Only
10.3 Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resultingin the deterioration of
product quality.
Soldering profile
Standard Profile Limit Profile
Pre-heating 150
180°C
90s±30s
Heating above 220°C
30s
60s above 230°C
60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter
φ
3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
10.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T
t
T
(T: Lower flange thickness)
Upper Limit
Recommendable
T
t
Limit Profile
Standard Profile
90s±30s
230
260
245℃±3℃
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.

LQH43PH221M26L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 1812 220uH 20% 220mA AEC-Q200
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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