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CPC1708J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
R07 www.ixysic.com 4
CPC1708
3 Performance Data @25°C (Unless Otherwise Noted)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
35
30
25
20
15
10
5
0
1.30 1.31 1.32 1.33 1.34
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA)
LED Forward Voltage (V)
Device Count (N)
35
30
25
20
15
10
5
0
2.9 4.0 5.1 7.36.2 8.4
Typical Turn-On Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Turn-On (ms)
Device Count (N)
0.116 0.132 0.1480.108 0.124 0.140
30
24
18
12
6
0
Turn-Off (ms)
Device Count (N)
Typical Turn-Off Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
35
30
25
20
15
10
5
0
0.040 0.045 0.050 0.055 0.060 0.065
On-Resistance (Ω)
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
Device Count (N)
0
5 1015202530354045
50
10
9
8
7
6
5
4
3
2
1
0
11
12
LED Forward Current (mA)
Turn-On (ms)
Typical Turn-On Time
vs. LED Forward Current
(I
L
=1A
DC
)
0
5 1015202530354045
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
50
LED Forward Current (mA)
Turn-Off (ms)
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=1A
DC
)
LED Current (mA)
-40
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
-40
14
12
10
8
6
4
2
0
-20 0 20 40 60 80 100
I
F
=10mA
I
F
=20mA
Turn-On (ms)
Typical Turn-On Time vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
-40
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
-20 0 20 40 60 80 100
I
F
=20mA
I
F
=10mA
Typical Turn-Off Time vs. Temperature
(I
L
=1A
DC
)
Turn-Off (ms)
Temperature (ºC)
I
NTEGRATED
C
IRCUITS
D
IVISION
5 www.ixysic.com R07
CPC1708
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
-40
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-20 0 20 40 60 80 100
On-Resistance (Ω)
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
-40
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
-20 0 20 40 60 80 100
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=max rated)
On-Resistance (Ω)
Temperature (ºC)
5.0
4.0
3.0
2.0
1.0
0.0
0 0.05 0.10 0.20 0.25
0.15
0.30
Load Voltage (V)
Load Current (A)
Typical Load Current vs. Load Voltage
(I
F
=10mA)
020406080 100
Load Current (A)
0
5
10
15
20
25
10ºC/W
Free Air
5ºC/W
1ºC/W
Maximum Load Current
vs. Temperature with Heat Sink
(I
F
=20mA)
Temperature (ºC)
-40
185
180
175
170
165
160
155
150
145
-20 0 20 40 60 80 100
Blocking Voltage vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
At Maximum Rated Voltage
Measured Across Pins 1 & 2
Temperature (ºC)
Leakage (μA)
35
30
25
20
15
10
5
1ms10µs 100µs 100ms 10s10ms 1s 100s
0
Energy Rating Curve
Free Air, No Heat Sink
Load Current (A)
Time
I
NTEGRATED
C
IRCUITS
D
IVISION
R07 www.ixysic.com 6
CPC1708
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1708J MSL 1
Device Maximum Temperature x Time
CPC1708J 245°C for 30 seconds
P1-P3P4-P6P7-P7

CPC1708J

Mfr. #:
Buy CPC1708J
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount DC Only Single Pole i4-PAC
Lifecycle:
New from this manufacturer.
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