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B57869S0303F140

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
Mounting instructions
1 Soldering
1.1 Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering Iron soldering
Bath temperature max. 260 °C max. 360 °C
Soldering time max. 4 s max. 2 s
Distance from thermistor min. 6 mm min. 6 mm
Under more severe soldering conditions the resistance may change.
1.1.1 Wave soldering
Temperature characteristic at component terminal with dual wave soldering
1.2 Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Page 7 of 21Please read Cautions and warnings and
Important notes at the end of this document.
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3 SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The use of no-clean solder products is recommended. In any case
mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
SMD NTCs with AgPd termination are not approved for lead-free soldering.
Nickel barrier termination
Figure 1
SMD NTC thermistors, structure of nickel
barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metallization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is tested for all commonly-used soldering methods according to IEC
60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in sol-
vent is not recommended.
The following test and process conditions apply for nickel barrier termination.
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Page 8 of 21Please read Cautions and warnings and
Important notes at the end of this document.
1.3.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 215 ±3 3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3
1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 260 ±5 10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1
1.3.3 Reflow soldering
Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Page 9 of 21Please read Cautions and warnings and
Important notes at the end of this document.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

B57869S0303F140

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Manufacturer:
EPCOS / TDK
Description:
NTC Thermistors 30k 3964
Lifecycle:
New from this manufacturer.
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