Data Sheet
August 12, 2010
EQD075 Series Single Output: Eighth Brick Power Modules:
18-60Vdc Input; 3.3 to 5.0Vdc Output; 75
LINEAGE POWER 14
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
Power System representative for more details.
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note.
