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9
MP, MQ Series
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sales-alpha@alpha-elec.co.jp
Document No.: 67000
Revision: 25-Apr-2016
PERFORMANCE
Parameters Test Condition
ALPHA
Specification
ALPHA Typical
Test Data
Maximum Rated Operating Temperature
Working Temperature Range
Maximum Working Voltage
Maximum Working Current
125°C
-65°C to +175°C
MP=50V, MQ=100V
350 mA
Thermal Shock
Overload
–65°C/30 min.↔+175°C/30 min., 5 cycles
Rated Voltage x 2.5, 5 sec.
±0.05%
±0.05%
±0.01%
±0.01%
Low Temperature Storage and Operation
Substrate Bending Test
–65°C, No Load, 24 hrs.→Rated Voltage, 45 min.
Substrate Bent 3 mm, 60 sec.
±0.05%
±0.05%
±0.01%
±0.01%
Dielectric Withstanding Voltage
Insulation Resistance
Resistance to Soldering Heat
Moisture Resistance
Atmospheric: AC 200V, 1 min.
DC 100V, 1 min.
260°C, 10 sec.
+65°C to –10°C, 90% RH to 98% RH, Rated Voltage, 10 cycles (240 hrs.)
±0.01%
over 10,000 MΩ
±0.05%
±0.05%
±0.005%
over 10,000 MΩ
±0.01%
±0.03%
Shock
Vibration, High Frequency
100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks
20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs.
±0.02%
±0.02%
±0.01%
±0.01%
Life 125°C, Rated Power, 1.5 hr. – ON, 0.5 hr. – OFF, 2,000 hrs. ±0.05% ±0.03%
Storage Life 15°C to 35°C, 15% RH to 75% RH, No Load, 10,000 hrs. ±0.005% ±0.0025%
High Temperature Exposure 175°C, No Load, 2,000 hrs. ±0.05% ±0.03%
TAPE AND REEL PACKAGE (BASED ON EIA-481-1) (DIMENSIONS IN mm)
Tape Dimensions Reel Dimensions
Type A B C D E F G H J A N B C D W1 W2 r
MP
2.8
±0.2
3.9
±0.2
12.0
±0.3
5.5
±0.05
1.75
±0.1
4.0
±0.1
2.0
±0.05
4.0
±0.1
Dia. 1.5
±0.1-0
Dia. 178
±2
Dia. 60
min.
Dia. 13
±0.5
Dia. 21
±0.8
2
±0.5
12.4
+2.0-0
18.4
max.
1.0
±0.5
MQ
3.6
±0.2
5.2
±0.2
12.0
±0.3
5.5
±0.05
1.75
±0.1
8.0
±0.1
2.0
±0.05
4.0
±0.1
Dia. 1.5
±0.1-0
Reel Capacity
MP: 1,200 pieces/reel MQ: 800 pieces/reel
PRECAUTION IN USING FACE-BONDED CHIP RESISTORS
1. Storage
Storage conditions or environment may adversely affect solderability of
the exterior terminals. Do not store in high temperature and humidity.
The recommended storage environment is lower than 40°C, has less
than 70% RH humidity and is free from harmful gases such as sulphur
and chlorine.
2. Caution in Soldering
➊ Hand Soldering
Hand soldering is applicable as shown at right.
Recommended
• Temp. of iron tip: 240°C to 270°C
• Power of iron: 20W or less
• Diameter of tip: dia. 3 mm max.
➋ Solder Reflow in Furnace
Recommended
• Peak temperature: 250+0/-5°C
• Holding time: 10 sec. max.
• To cool gradually at room temperature
➌ Dipping in Solder (Wave or Still)
Recommended
• Temp. of solder: 260°C max
• Length of dipping: 10 seconds
• To cool gradually at room temperature
➍ Other
Corrosion-free flux, such as rosin, is recommended. Do not apply
pressure to the molded housing immediately after soldering.
3. Cleaning
Use volatile cleaner such as methylalcohol or propyl alcohol.
4. Circuit Board Design
The dimensions of solder land must be determined in conformity with
the size of resistors and with the soldering method. They are also
subject to the mounting machine and the material of the substrate. See
example below.
When parts are mounted on a board in high density, solder can possibly
attach to the resistors in an excessive amount to affect performance or
reliability of the resistors. To prevent this effect, the use of solder resist
is recommended to isolate solder lands.
40 5020
Not Applicable
Applicable
10 30
350
310
270
230
60 (sec.)
Length of contact
(°C)
D
Solder land
Adhesive (in wave soldering)
A
C
Terminal
B
Resistor
Circuit Board
Type
MP
MQ
A
1.6 to 2.0
B
0.5 to 1.5
C
2.2 to 2.6
D
1.8
2.5
Dimensions in mm
