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Female Card Edge
Female Card Edge
DIMENSIONS
Dimensionsin[]areinmillimeters,allothersareininches.
CONTACT MARKINGS
(LETTERS G,I,O & Q NOT USED)
1 2 3 ... 23 24 ... 45 46 ...
A B C ... a b ... AA BB ...
A
C
D
B
E
F
REFER TO
MOUNTING STYLE
1 2 3 48 49 50
A B C DD EE FF
REFER TO TERMINATION TYPE
.125 [3.18] TYP.
.265 [6.73]
INSERTION DEPTH
[10.95].431
[6.22].245
[0.64]
.025
.125” [3.18 mm] Contact Centers, .431” [10.95 mm] Insulator Height,
Dip Solder/Eyelet/Right Angle for .062” [1.57 mm] or .031” [0.79 mm] Mating PCB
Tolerances on non-critical dimensions may very slightly due to shrinkage differential per insulator material; Consult factory.
POSITIONS/
CONTACTS
INCHES MILLIMETERS
A±.008 B±.008 C±.015 D±.010 E±.020 F+.005/-.015 A±0.20 B±0.20 C±0.38 D±0.25 E±0.51 F+0.13/-0.38
06/12 0.625 0.875 1.035 1.295 1.575
0.330
15.88 22.23 26.29 32.89 40.01
8.38
10/20 1.125 1.375 1.535 1.795 2.075 28.58 34.93 38.99 45.59 52.71
14/28 1.625 1.875 2.035 2.295 2.575 41.28 47.63 51.69 58.29 65.41
15/30 1.750 2.000 2.160 2.420 2.700 44.45 50.80 54.86 61.47 68.58
18/36 2.125 2.375 2.535 2.795 3.075 53.98 60.33 64.39 70.99 78.11
22/44 2.625 2.875 3.035 3.295 3.575 66.68 73.03 77.09 83.69 90.81
28/56 3.375 3.625 3.785 4.045 4.325 85.73 92.08 96.14 102.74 109.86
30/60 3.625 3.875 4.035 4.295 4.575 92.08 98.43 102.49 109.09 116.21
31/62 3.750 4.000 4.160 4.420 4.700 95.25 101.60 105.66 112.27 119.38
35/70 4.250 4.500 4.660 4.920 5.200 107.95 114.30 118.36 124.97 132.08
36/72 4.375 4.625 4.785 5.045 5.325 111.13 117.48 121.54 128.14 135.26
37/74 4.500 4.750 4.910 5.170 5.450 114.30 120.65 124.71 131.32 138.43
40/80 4.875 5.125 5.285 5.545 5.825
0.370
123.83 130.18 134.24 140.84 147.96
9.40
43/86 5.250 5.500 5.660 5.920 6.200 133.35 139.70 143.76 150.37 157.48
44/88 5.375 5.625 5.785 6.045 6.325 136.53 142.88 146.94 153.54 160.66
49/98 6.000 6.250 6.410 6.670 6.950 152.40 158.75 162.81 169.42 176.53
50/100 6.125 6.375 6.535 6.795 7.075 155.58 161.93 165.99 172.59 179.71
MATERIALS (INSULATOR/CONTACT)
E = PBT/PhosphorBronze(Standard)
R = PPS/PhosphorBronze
G = PA9T/PhosphorBronze
H = PBT/BerylliumCopper
A = PPS/BerylliumCopper
J = PA9T/BerylliumCopper
* F = PPS/Spinodal(OverallGoldPlatingOnly)
Consultfactoryforspecialsolderingguidelines.
*C = PPS/BerylliumNickel(OverallGoldPlatingOnly)
*W = PEEK/BerylliumNickel(OverallGoldPlatingOnly)
*Consultfactoryforavailability.
RefertoPage7forOperating/ProcessingTemperatures
CONTACT FINISH - RoHS Compliant
All platings are Lead Free and have .000050” Nickel underplate
CONTACT CENTERS
A = .125”[3.18mm]
NUMBER OF CONTACT POSITIONS
D = Dual
H = HalfLoaded
H = .125”[3.18mm]ClearanceHoles
N = NoMounting
S = SideMounting
I = ThreadedInsert
F = FloatingBobbin
RA = RightAngle
RE = Eyelet(Standard)
TE = Eyelet(OverallPlatedOnly)
RT = .140”[3.56mm]X.200”[5.08mm]DipSolder
RY = .140”[3.56mm]X.440”[11.19mm]DipSolder
RX = .200”[5.08mm]X.185”[4.70mm]DipSolder
RJ = .250”[6.35mm]X.165”[4.19mm]DipSolder
MODIFICATION CODE (ConsultFactory)
OMITFORSTANDARD
READOUT (Opposite Page)
MOUNTING STYLE (Opposite Page)
TERMINATION TYPE (Opposite Page)
-S13 = CardExtenderAccepts.062”[1.57mm]PCB
(RE,RT,RYTerminationsOnly)
-S734 = .031”±.006”[0.79mm±0.15mm]ThickPCB
SeeChartBelow
E B A 43 D RE H - Sxxx
Contact Surface Termination
B = .000010”Gold .000100”PureTin,Matte
C = .000030”Gold .000100”PureTin,Matte
G = .000010”Gold .000005”Gold
Y = .000030”Gold .000005”Gold
Contact Surface Overall Plating
S = .000010”Gold .000010”Gold
M = .000030”Gold .000010”Gold
E = .000100”PureTin,Matte .000100”PureTin,Matte
PART NUMBER OPTIONS