DF9A-15S-1V(22)

A284
Bottom Entry Header
[Specific No.] _ **, (**)
(20): Tin plating tube packaging
(21):
Gold plating embossed tape packaging
Part Number CL No.
DF9L-31P-1V (**) 540-0215-7-**
31 21.64 14 15 19.4 22
KK
With metal fitting
Number of Contacts
A B C D
Tube Packaging
Quantity
Spec.
(29)
Spec.
(21)
Remarks
Product Type Size
DF9L-31P-1V 31 32 28.4 14.2 32.4
Number of Contacts
A B C D
Note 1 : Please order the tube packaging product by multiplying the packaging quantity ( pcs.).
Note 2 : Please order the embossed tape packaging product per reel. (1000 pcs. per reel)
Note 3 : The vacuum area on the embossed tape product utilizes the connector case surface. However, it is necessary to check the
previous vacuum, because the surface isn't always plain.
Note : The shaded area indicates the through-hole area.
Note : The 2.9mm board to board size does not include the soldering paste
thickness.
B
Recommended PCB mounting pattern
BApplication Pattern
BTube Size
BEmbossed Carrier Tape Dimensions
Board
Board
Board punching area
Unit: mm
A285
BPrecautions for Use
1.
Recommended Temperature Profile (SMT)
Note 1 :
Maximum twice action is allowed under the same condition. However, the interval between
the first process and second actions must be maintained at the room temperature.
Note 2 : The temperature indicates the board surface temperature in the connector lead area.
2.
Recommended Manual Soldering Condition (SMT)
Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds
3. Recommended Screen Thickness (SMT) 0.15mm
4. Board Warp(SMT) Maximum 0.03mm in the connector center area, based on both connector edges.
5. Cleaning Condition Refer to the "Nylon Connector Use Hand book".
6. Cautions
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.
Excessive scoop insertion or extraction may result in damage.
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
The color phase of this product may be slightly different from that of the forming product according to the
manufacturing lot. However, the difference doesn't affect the performance.
Temperature
Time
Maximum
Preheating area Soldering area
IR reflow condition
Preheating area 150ç
for 100 to 120 seconds
Soldering area 235±5ç
for 10 seconds max.
220ç
Min for 10 to 30 second

DF9A-15S-1V(22)

Mfr. #:
Manufacturer:
Hirose Electric
Description:
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 15P TIN PLT W/BOSS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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