MC14093BCPG Datasheet MC14093BDR2G, MC14093BDG, MC14093BDTR2G | P4-P6

MC14093B

http://onsemi.com

4

SWITCHING CHARACTERISTICS (C

L

= 50 pF, T

A

= 25_C)

Characteristic

Symbol

V

DD

Vdc

Min

Typ

(Note 5)

Max Unit

Output Rise Time t

TLH

5.0

10

15

−

100

50

40

200

100

80

ns

Output Fall Time t

THL

5.0

10

15

−

100

50

40

200

100

80

ns

Propagation Delay Time t

PLH

, t

PHL

5.0

10

15

−

125

50

40

250

100

80

ns

5. Data labeled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

Figure 1. Switching Time Test Circuit and Waveforms

PULSE

GENERATOR

V

DD

OUTPUT

C

L

V

SS

7

14

INPUT

20 ns 20 ns

V

DD

V

SS

V

OH

V

OL

t

PLH

t

PHL

OUTPUT

INPUT

t

THL

t

TLH

90%

50%

10%

90%

50%

10%

V

out

V

in

V

H

V

DD

V

SS

V

DD

V

SS

(a) Schmitt Triggers will square up

(a) inputs with slow rise and fall times.

(b) A Schmitt trigger offers maximum

(b) noise immunity in gate applications.

V

H

V

out

V

in

V

DD

V

SS

V

DD

V

SS

Figure 2. Typical Schmitt Trigger Applications

MC14093B

http://onsemi.com

5

Figure 3. Typical Output Source

Characteristics Test Circuit

V

DS

, DRAIN VOLTAGE (Vdc)

-10 -8.0 -6.0 -4.0 -2.0 0

0

-2.0

-4.0

-6.0

-8.0

-10

I

OH

, DRAIN CURRENT (mAdc)

Figure 4. Typical Output Sink

Characteristics Test Circuit

V

DS

, DRAIN VOLTAGE (Vdc)

0 2.0 4.0 6.0 8.0 10

10

8.0

6.0

4.0

2.0

0

I

OL

, DRAIN CURRENT (mAdc)

14

7

V

GS

V

out

I

OH

All unused inputs

connected to ground.

All unused inputs

connected to ground.

14

7

V

out

I

OL

V

GS

V

out

, OUTPUT VOLTAGE (Vdc)

V

DD

0

0V

DD

V

T-

V

T+

V

H

V

in

, INPUT VOLTAGE (Vdc)

Figure 5. Typical Transfer Characteristics

V

GS

= -5.0 Vdc

c

b

a

c

b

c

b

a

-15 Vdc

-10 Vdc

aT

A

= -55°C

bT

A

= +25°C

bT

A

= +125°C

a

b

c

a

b

c

a

b

c

5.0 Vdc

aT

A

= -55°C

bT

A

= +25°C

cT

A

= +125°C

15 Vdc

V

GS

= 10 Vdc

MC14093B

http://onsemi.com

6

PACKAGE DIMENSIONS

SOIC−14 NB

CASE 751A−03

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

H

14

8

71

M

0.25 B

M

C

h

X 45

SEATING

PLANE

A1

A

M

_

S

A

M

0.25 B

S

C

b

13X

B

A

E

D

e

DETAIL A

L

A3

DETAIL A

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

D 8.55 8.75 0.337 0.344

E 3.80 4.00 0.150 0.157

A 1.35 1.75 0.054 0.068

b 0.35 0.49 0.014 0.019

L 0.40 1.25 0.016 0.049

e 1.27 BSC 0.050 BSC

A3 0.19 0.25 0.008 0.010

A1 0.10 0.25 0.004 0.010

M 0 7 0 7

H 5.80 6.20 0.228 0.244

h 0.25 0.50 0.010 0.019

__ __

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC14093BCPG

MC14093BCPG

Products related to this Datasheet