YFT-40-05-H-05-SB-K

THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
PROPRIETARY NOTE
*
*
DO NOT
SCALE FROM
THIS PRINT
YFT-XX-05-X-XX-SB-XX
No OF POSITIONS
-20 THRU -50
(MULTIPLES OF 10 ONLY)
ROW SPECIFICATION
OPTION
-K: KAPTON PAD OPTION
(SEE TABLE 3 & FIG. 4, SHEET 2)
-TR: TAPE & REEL
PLATING SPECIFICATION
-G: GOLD (USE T-1R24-05B-G-1)
-H: HEAVY GOLD (USE T-1R24-05B-H-1)
-E: EXTRA HEAVY GOLD
(USE T-1R24-05B-E-1)
LEAD STYLE
-10: TEN ROWS (USE YFTP-XX-X)
-08: EIGHT ROWS (USE YFTP-XX-X)
-05: FIVE ROWS (USE YFTP-XX-X)
-06: SIX ROWS (USE YFTP-XX-X)
(AVAILABLE IN 20 POS. ONLY)
-03: THREE ROWS (USE YFTP-XX-X)
(AVAILABLE IN 20 POS. ONLY)
OPTION
-SB: SOLDER BALLS: 37% PB/63% SN
(USE SDB-030-6337)
C
(No OF POS x .0500[1.270])
+ .100[2.54] REF
.0350
REF
0.889
.155 3.94
REF
.105
REF
2.67
(No OF ROWS x .0500[1.270]) + .120[3.05] REF
(No OF ROWS - 1)
x .0500[1.270]
(No OF POS - 1) x .0500[1.270]
.040
REF
1.02
01
02
10
.149
REF
3.78
.018
REF
0.46
"A"
"A"
YFTP-XX-X-X
FIG 1
YFT-20-05-X-10-SB SHOWN
.1380
REF
3.505
.079
REF
2.01
( SEE IN-PROCESS, SHEET 2)
.0160 0.406
REF
.010 0.26
.077 1.96 .177 4.50
.005
MAX
0.13
(SEE NOTE 7)
2
MAX SWAY
(ANY DIRECTION)
SECTION "A"-"A"
.030[.76] REF SOLDERBALL
SDB-030-XXXX
T-1R24-05B-X-1
C
C
C
C
C
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS ANGLES
.XX:
.01
2
.XXX:
.005
.XXXX:
.0020
MATERIAL:
FleX, Y, Z, .050 CENTERLINE TERMINAL ASSEMBLY
BY:
YFT-XX-05-X-XX-SB-XX
DWG. NO.
DESCRIPTION:
ERIC M
5/27/99
2
1
SHEET SCALE: 1.875:1
INSULATOR: LCP, COLOR: BLACK
TERMINAL: BRASS AND ALLOY 260
F:\DWG\MISC\MKTG\YFT-XX-05-X-XX-SB-XX-MKT.SLDDRW
NOTES:
1. NOTE DELETED.
2. REPRESENTS A CRITICAL DIMENSION.
3. BURR ALLOWANCE: .0015 MAX.
4. NOTE DELETED.
5. MINIMUM PUSHOUT FORCE: .5 LB.
6. NOTE DELETED.
7. MAXIMUM ALLOWABLE DISTANCE FOR SOLDER WICKING UP TERMINAL.
8. .0040 MAX VARIATION BETWEEN SOLDERBALLS.
9. REFER TO VISUAL INSPECTION BOARD FOR SOLDERBALL APPEARANCE CHECKS.
10. THE DISTANCE FROM THE CENTER OF ANY SOLDERBALL TO THE CENTER OF ANY
ADJACENT INNER PEG SHALL BE .025
.005.
11. NOTE DELETED.
12. TRAY PACKAGING CAN BE SUBSTITUTED FOR TUBES.
DO NOT SCALE DRAWING
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
REVISION Y
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
PROPRIETARY NOTE
*
*
"R"
"B"
"S"
"C"
.020 [0.51]
-K: KAPTON PAD OPTION
(YFT-120-05-X-08-K SHOWN)
R = (No OF POS x .0500 [1.270]) + .100 [2.54]
S = ("R" - "B" / 2)
.020 [.51]
FIG 2
.182 4.623
PACKAGING TUBE
(SEE NOTE 12)
[PLACE PARTS IN RESPECTIVE TUBES SIMILAR TO SHOWN BELOW]
PT-1-24-01-59
PT-1-24-02-09
-03 ROW
-08 ROW
-10 ROW
(AFTER REPRESS)
.006 [.15]-.010 [.25]
IN-PROCESS WITHOUT SOLDERBALLS
C
PT-1-24-16-29
SHEET OF
FleX, Y, Z, .050 CENTERLINE TERMINAL ASSEMBLY
BY:
YFT-XX-05-X-XX-SB-XX
DWG. NO.
DESCRIPTION:
DO NOT SCALE DRAWING
ERIC M
5/27/99
2
2
SHEET SCALE: 1.875:1
REVISION Y
F:\DWG\MISC\MKTG\YFT-XX-05-X-XX-SB-XX-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322

YFT-40-05-H-05-SB-K

Mfr. #:
Manufacturer:
Samtec
Description:
Board to Board & Mezzanine Connectors
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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