IXA20IF1200HB

IXA20IF1200HB
S
Ø P
Ø P1
D2
D1
E1
4
123
L
L1
2x b2
3x b
b4
2x e
2x E2
D
E
Q
A
A2
A1
C
Sym. Inches Millimeter
min. max. min. max.
A 0.185 0.209 4.70 5.30
A1 0.087 0.102 2.21 2.59
A2 0.059 0.098 1.50 2.49
D 0.819 0.845 20.79 21.45
E 0.610 0.640 15.48 16.24
E2 0.170 0.216 4.31 5.48
e 0.215 BSC 5.46 BSC
L 0.780 0.800 19.80 20.30
L1 - 0.177 - 4.49
Ø P 0.140 0.144 3.55 3.65
Q 0.212 0.244 5.38 6.19
S 0.242 BSC 6.14 BSC
b 0.039 0.055 0.99 1.40
b2 0.065 0.094 1.65 2.39
b4 0.102 0.135 2.59 3.43
c 0.015 0.035 0.38 0.89
D1 0.515 - 13.07 -
D2 0.020 0.053 0.51 1.35
E1 0.530 - 13.45 -
Ø P1 - 0.29 - 7.39
2(C)
3(E)
(G) 1
Outlines TO-247
IXYS reserves the right to change limits, conditions and dimensions.
20100102aData according to IEC 60747and per semiconductor unless otherwise specified
© 2010 IXYS all rights reserved
IXA20IF1200HB
0123
0
5
10
15
20
25
3
0
0 5 10 15 20 25 30 35
0
1
2
3
4
012345
0
5
10
15
20
25
3
0
V
CE
[V]
I
C
[A]
Q
G
[nC]
V
GE
[V]
9 V
11 V
5678910111213
0
5
10
15
20
25
30
0 102030405060
0
5
10
15
20
13 V
40 60 80 100 120 140 160
1.2
1.6
2.0
2.4
2.8
E
[mJ]
E
on
Fig. 1 Typ. output characteristics
V
CE
[V]
I
C
[A]
V
GE
=15 V
17 V
19 V
Fig. 2 Typ. output characteristics
I
C
[A]
Fig. 3 Typ. tranfer characteristics
V
GE
[V]
Fig. 4 Typ. turn-on gate charge
Fig. 5 Typ. switching energy vs. collector current
E
off
Fig. 6 Typ. switching energy vs. gate resistance
R
G
[]
E
[mJ]
I
C
[A]
R
G
=56
V
CE
= 600 V
V
GE
= ±15 V
T
VJ
=125°C
E
on
E
off
I
C
=15A
V
CE
= 600 V
V
GE
= ±15 V
T
VJ
=125°C
I
C
=15A
V
CE
=600V
T
VJ
=125°C
T
VJ
=25°C
V
GE
=15 V
T
VJ
=125°C
T
VJ
= 125°C
T
VJ
=25°C
IGBT
IXYS reserves the right to change limits, conditions and dimensions.
20100102aData according to IEC 60747and per semiconductor unless otherwise specified
© 2010 IXYS all rights reserved
IXA20IF1200HB
200 300 400 500 600 700
1
2
3
4
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0
10
20
30
40
Q
rr
[µC]
I
F
[A]
V
F
[V] di
F
/dt [A/µs]
T
VJ
=125°C
T
VJ
= 25°C
T
VJ
= 125°C
V
R
= 600 V
10 A
20 A
40 A
Fig. 7 Typ. Forward current versus V
F
Fig. 8 Typ. reverse recov.charge Q
rr
vs. di/dt
200 300 400 500 600 700
0
5
10
15
20
25
30
35
I
RR
[A]
di
F
/dt [A/µs]
T
VJ
=125°C
V
R
=600V
10 A
20 A
40 A
Fig. 9 Typ. peak reverse current I
RM
vs. di/dt
200 300 400 500 600 700
0
100
200
300
400
500
600
700
t
rr
[ns]
di
F
/dt [A/µs]
10 A
20 A
40 A
T
VJ
= 125°C
V
R
=600 V
Fig. 10 Typ. recovery time t
rr
versus di/dt
Fig. 11 Typ. recovery energy E
rec
versus di/dt
200 300 400 500 600 700
0.2
0.4
0.6
0.8
1.0
1.2
1.4
E
rec
[mJ]
di
F
/dt [A/µs]
T
VJ
=125°C
V
R
=600 V
10 A
20 A
40 A
0.001 0.01 0.1 1 10
0.1
1
t
p
[s]
Z
thJC
[K/W]
Fig. 12 Typ. transient thermal impedance
Diode
IGBT
Inverter-IGBT Inverter-FRD
R
i
t
i
R
i
t
i
1 0.15 0.0006 0.231 0.0005
2 0.28 0.2 0.212 0.004
3 0.16 0.006 0.19 0.02
4 0.17 0.05 0.267 0.15
Diode
IXYS reserves the right to change limits, conditions and dimensions.
20100102aData according to IEC 60747and per semiconductor unless otherwise specified
© 2010 IXYS all rights reserved

IXA20IF1200HB

Mfr. #:
Manufacturer:
Littelfuse
Description:
IGBT Transistors XPT IGBT Copack
Lifecycle:
New from this manufacturer.
Delivery:
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