MT41K256M16TW-107 XIT:P TR Datasheet MT41K256M16TW-107 XIT:P, MT41K256M16TW-107 XIT:P TR, MT41K512M8DA-107 XIT:P TR | P1-P3

DDR3L SDRAM Data Sheet Addendum

MT41K1G4 – 128 Meg x 4 x 8 banks

MT41K512M8 – 64 Meg x 8 x 8 banks

MT41K256M16 – 32 Meg x 16 x 8 banks

Description

DDR3L SDRAM (1.35V) is a low voltage version of the

DDR3 (1.5V) SDRAM. Refer to DDR3 (1.5V) SDRAM

(Die Rev.: E) data sheet specifications when running in

1.5V compatible mode.

Features

• V

= V

DDQ

= 1.35V (1.283–1.45V)

• Backward compatible to V

= V

DDQ

= 1.5V ±0.075V

– Supports DDR3L devices to be backward com-

patible in 1.5V applications

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• T

of 0°C to +95°C

– 64ms, 8192-cycle refresh at 0°C to +85°C

– 32ms at +85°C to +95°C

• Self refresh temperature (SRT)

• Automatic self refresh (ASR)

• Write leveling

• Multipurpose register

• Output driver calibration

Options Marking

• Configuration

– 1 Gig x 4 1G4

– 512 Meg x 8 512M8

– 256 Meg x 16 256M16

• FBGA package (Pb-free) – x4, x8

– 78-ball (8mm x 10.5mm) Rev. P DA

• FBGA package (Pb-free) – x16

– 96-ball (8mm x 14mm) Rev. P TW

• Timing – cycle time

– 938ps @ CL = 14 (DDR3-2133) -093

– 1.07ns @ CL = 13 (DDR3-1866) -107

– 1.25ns @ CL = 11 (DDR3-1600) -125

• Special Options

– Premium Lifecycle Product (PLP) X

• Operating temperature

– Commercial (0°C ≤ T

≤ +95°C) None

– Industrial (–40°C ≤ T

≤ +95°C) IT

• Revision P

Table 1: Key Timing Parameters

Speed Grade Data Rate (MT/s) Target

RCD-

RP-CL

RCD (ns)

RP (ns) CL (ns)

-093

1, 2

2133 14-14-14 13.09 13.09 13.09

-107

1866 13-13-13 13.91 13.91 13.91

-125 1600 11-11-11 13.75 13.75 13.75

Notes:

1. Backward compatible to 1600, CL = 11 (-125).

2. Backward compatible to 1866, CL = 13 (-107).

4Gb: x4, x8, x16 DDR3L SDRAM Addendum

Description

PDF: X26P4QTWDSPK-13-10329

4gb_1_35v_ddr3l_xit_addendum.pdf - Rev. A 02/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

Table 2: Addressing

Parameter 1 Gig x 4 512 Meg x 8 256 Meg x 16

Configuration 128 Meg x 4 x 8 banks 64 Meg x 8 x 8 banks 32 Meg x 16 x 8 banks

Refresh count 8K 8K 8K

Row address 64K (A[15:0]) 64K (A[15:0]) 32K (A[14:0])

Bank address 8 (BA[2:0]) 8 (BA[2:0]) 8 (BA[2:0])

Column address 2K (A[11, 9:0]) 1K (A[9:0]) 1K (A[9:0])

Page size 1KB 1KB 2KB

Figure 1: DDR3L Part Numbers

Example Part Number: MT41K256M16TW-107 XIT:P

Configuration

1 Gig x 4

512 Meg x 8

256 Meg x 16

1G4

512M8

256M16

Configuration

MT41K

Package Speed

Revision

Revision:P

Commercial

Industrial temperature

{

None

Package

Mark

Rev.

Speed Grade

CK = 1.07ns, CL = 13

CK = 1.25ns, CL = 11

-093

-125

Temperature

78-ball 8mm x 10.5mm FBGA

P DA

CK = .938ns, CL = 14

-107

96-ball 8mm x 14mm FBGA

P TW

Special Options

Premium Lifecycle Product (PLP)

Mark

Note:

1. Not all options listed can be combined to define an offered product. Use the part catalog search on

http://www.micron.com for available offerings.

FBGA Part Marking Decoder

Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the

part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:

http://www.micron.com.

4Gb: x4, x8, x16 DDR3L SDRAM Addendum

Description

PDF: X26P4QTWDSPK-13-10329

4gb_1_35v_ddr3l_xit_addendum.pdf - Rev. A 02/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Revision History

Rev. A – 02/16

• Initial release based on the 4Gb x4, x8, x16 DDR3L SDRAM, Rev. N 12/15 data sheet

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000

www.micron.com/products/support Sales inquiries: 800-932-4992

Micron and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.

Although considered final, these specifications are subject to change, as further product development and data characterization some-

times occur.

4Gb: x4, x8, x16 DDR3L SDRAM Addendum

Revision History

PDF: X26P4QTWDSPK-13-10329

4gb_1_35v_ddr3l_xit_addendum.pdf - Rev. A 02/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

P1-P3

MT41K256M16TW-107 XIT:P TR

Mfr. #:

Buy MT41K256M16TW-107 XIT:P TR

Manufacturer:

Micron

Description:

DRAM DDR3 4G 256MX16 FBGA

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

MT41K256M16TW-107 XIT:P TR

MT41K256M16TW-107 XIT:P TR

Products related to this Datasheet