LT3791-1
22
37911fa
For more information www.linear.com/LT3791-1
applicaTions inForMaTion
n
The path formed by switch M1, switch M2, D1 and the
C
IN
capacitor should have short leads and PC trace
lengths. The path formed by switch M3, switch M4, D2
and the C
OUT
capacitor also should have short leads
and PC trace lengths.
n
The output capacitor (–) terminals should be connected
as close as possible to the (–) terminals of the input
capacitor.
n
Connect the top driver bootstrap capacitor, C1, closely
to the BST1 and SW1 pins. Connect the top driver
bootstrap capacitor, C2, closely to the BST2 and SW2
pins.
n
Connect the input capacitors, C
IN
, and output capacitors,
C
OUT
, closely to the power MOSFETs. These capaci-
tors carry the MOSFET AC current in boost and buck
operation.
n
Route SNSN and SNSP leads together with minimum
PC trace spacing. Avoid sense lines pass through noisy
areas, such as switch nodes. Ensure accurate current
sensing with Kelvin connections at the SENSE resistor.
n
Connect the V
C
pin compensation network close to the
IC, between V
C
and the signal ground pins. The capaci-
tor helps to filter the effects of PCB noise and output
voltage ripple voltage from the compensation loop.
n
Connect the INTV
CC
bypass capacitor, C
VCC
, close to the
IC, between the INTV
CC
and the power ground pins. This
capacitor carries the MOSFET drivers’ current peaks. An
additional 0.1µF ceramic capacitor placed immediately
next to the INTV
CC
and PGND pins can help improve
noise performance substantially.
