DS1644/DS1644P
11 of 14
NOTES:
1. All voltages are referenced to ground.
2. Typical values are at 25C and nominal supplies.
3. Outputs are open.
4. Data retention time is at 25C and is calculated from the date code on the device package. The date
code XXYY is the year followed by the week of the year in which the device was manufactured. For
example, 9225 would mean the 25
th
week of 1992.
5. t
AH1
, t
DH1
are measured from WE going high.
6. t
AH2
, t
DH2
are measured from CE going high.
7. Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
techniques as long as temperatures as long as temperature exposure to the lithium energy source
contained within does not exceed +85C. Post solder cleaning with water washing techniques is
acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live - bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick
to remove solder.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
28 EDIP MDF28+3
21-0245
34 PWRCP PC2+2
21-0246
