SI7465DP-T1-E3

Vishay Siliconix
Si7465DP
Document Number: 73113
S09-0271-Rev. C, 16-Feb-09
www.vishay.com
1
P-Channel 60-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Available
TrenchFET
®
Power MOSFET
New Low Thermal Resistance PowerPAK
®
Package with Low 1.07 mm Profile
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
- 60
0.064 at V
GS
= - 10 V
- 5
26
0.080 at V
GS
= - 4.5 V
- 4.5
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerP AK SO-8
Bottom View
Ordering Information:
Si7465DP-T1-E3 (Lead (Pb)-free)
Si7465DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
G
D
P-Channel MOSFE
T
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile (www.vishay.com/ppg?73257
). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol 10 s Steady State Unit
Drain-Source Voltage
V
DS
- 60
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150°C)
a
T
A
= 25 °C
I
D
- 5 - 3.2
A
T
A
= 70 °C
- 4 - 2.6
Pulsed Drain Current
I
DM
- 25
Continuous Source Current (Diode Conduction)
a
I
S
- 2.9 - 1.2
Avalanche Current
L = 0.1 mH
I
AS
22
Single Pulse Avalanche Energy
E
AS
24.2 mJ
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
3.5 1.5
W
T
A
= 70 °C
2.2 0.94
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
b,c
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 10 s
R
thJA
27 36
°C/WSteady State 60 85
Maximum Junction-to-Case (Drain) Steady State
R
thJC
3.3 4.3
www.vishay.com
2
Document Number: 73113
S09-0271-Rev. C, 16-Feb-09
Vishay Siliconix
Si7465DP
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1.0 - 3.0 V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 60 V, V
GS
= 0 V
- 1
µA
V
DS
= - 60 V, V
GS
= 0 V, T
J
= 70 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 10 V
- 25 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 5 A
0.051 0.064
Ω
V
GS
= - 4.5 V, I
D
= - 4.5 A
0.064 0.080
Forward Transconductance
a
g
fs
V
DS
= - 15 V, I
D
= - 5 A
16 S
Diode Forward Voltage
a
V
SD
I
S
= - 2.9 A, V
GS
= 0 V
- 0.8 - 1.2 V
Dynamic
b
Total Gate Charge
Q
g
V
DS
= - 30 V, V
GS
= - 10 V, I
D
= - 5 A
26 40
nCGate-Source Charge
Q
gs
4.5
Gate-Drain Charge
Q
gd
7.0
Gate Resistance
R
g
7.0 Ω
Tur n - O n Delay Tim e
t
d(on)
V
DD
= - 30 V, R
L
= 30 Ω
I
D
- 1.0 A, V
GEN
= –10 V, R
g
= 6 Ω
815
ns
Rise Time
t
r
915
Turn-Off Delay Time
t
d(off)
65 100
Fall Time
t
f
30 45
Source-Drain Reverse Recovery Time
t
rr
I
F
= - 5 A, dI/dt = 100 A/µs
41 70
Output Characteristics
0
5
10
15
20
25
30
0246810
V
GS
= 10 V thru 5 V
3 V
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
4 V
Transfer Characteristics
0
5
10
15
20
25
30
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
25 °C
T
C
= 125 °C
- 55 °C
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
Document Number: 73113
S09-0271-Rev. C, 16-Feb-09
www.vishay.com
3
Vishay Siliconix
Si7465DP
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0 5 10 15 20 25 30
V
GS
= 10 V
I
D
- Drain Current (A)
V
GS
= 4.5 V
R
DS(on)
- On-Resistance (Ω)
0
4
8
12
16
20
0 1020304050
V
DS
= 30 V
I
D
= 5 A
- Gate-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
V
GS
0.0 0.2 0.4 0.6 0.8 1.0 1.2
V
SD
- Source-to-Drain Voltage (V)
T
J
= 150 °C
T
J
= 25 °C
40
10
1
I
S
- Source Current (A)
Capacitance
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
0
300
600
900
1200
1500
1800
0 102030405060
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
rss
oss
C
iss
C
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
-
50
-
25 0
2
5
5
0
7
5 100 125 150
V
GS
= 10 V
I
D
= 5 A
T
J
- Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0246810
R
DS(on)
- On-Resistance (Ω)
V
GS
- Gate-to-Source Voltage (V)
I
D
= 5 A

SI7465DP-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -60V Vds 20V Vgs PowerPAK SO-8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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