NTP45N06L, NTB45N06L
http://onsemi.com
5
0
I
D
= 45 A
T
J
= 25°C
V
GS
Q
2
Q
1
Q
T
V
GS
1000
100
10
1
0.1
1000
100
10
6
5
4
3
2
1
0
280
200
80
40
0
48
40
32
24
0
10
3600
2800
10
2400
2000
15520
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE
(VOLTS)
1600
1200
800
400
0
5
Q
g
, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
R
G
, GATE RESISTANCE (W)
Figure 10. Diode Forward Voltage vs. Current
V
SD
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
I
S
, SOURCE CURRENT (AMPS)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
T
J
, STARTING JUNCTION TEMPERATURE (°C)
D
E
AS
, SINGLE PULSE DRAIN−TO−SOURCE
AVALANCHE ENERGY (mJ)
25 0 16 2012842
1 10 100 0.6 0.76 0.880.720.68 0.920.64 1
0.10 10 1001 25 125 15010075 17
50
V
GS
= 0 VV
DS
= 0 V
T
J
= 25°C
C
rss
C
iss
C
oss
C
rss
16
8
0.8 0.84
C
iss
V
GS
= 15 V
SINGLE PULSE
T
C
= 25°C
V
DS
= 30 V
I
D
= 45 A
V
GS
= 5 V
V
GS
= 0 V
T
J
= 25°C
I
D
= 45 A
10 ms
1 ms
100 ms
dc
t
r
t
d(off)
t
d(on)
t
f
V
DS
3200
0.96
120
160
240
R
DS(on)
Limit
Thermal Limit
Package Limit
4000