NTP45N06L, NTB45N06L
http://onsemi.com
2
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating Symbol Value Unit
Drain−to−Source Voltage V
DSS
60 Vdc
Drain−to−Gate Voltage (R
GS
= 10 MW)
V
DGR
60 Vdc
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (t
p
v10 ms)
V
GS
V
GS
"15
"20
Vdc
Drain Current
− Continuous @ T
A
= 25°C
− Continuous @ T
A
= 100°C
− Single Pulse (t
p
v10 ms)
I
D
I
D
I
DM
45
30
150
Adc
Apk
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C (Note 1)
Total Power Dissipation @ T
A
= 25°C (Note 2)
P
D
125
0.83
3.2
2.4
W
W/°C
W
W
Operating and Storage Temperature Range T
J
, T
stg
−55 to +175 °C
Single Pulse Drain−to−Source Avalanche Energy − Starting T
J
= 25°C
(V
DD
= 50 Vdc, V
GS
= 5.0 Vdc, L = 0.3 mH
I
L(pk)
= 40 A, V
DS
= 60 Vdc, R
G
= 25 W)
E
AS
240 mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
q
JC
R
q
JA
R
q
JA
1.2
46.8
63.2
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8 in from case for 10 seconds T
L
260 °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size, (Cu Area 1.127 in
2
).
2. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in
2
).
ORDERING INFORMATION
Device Package Shipping
†
NTP45N06L TO−220 50 Units / Rail
NTP45N06LG TO−220
(Pb−Free)
50 Units / Rail
NTB45N06L D
2
PAK 50 Units / Rail
NTB45N06LG D
2
PAK
(Pb−Free)
50 Units / Rail
NTB45N06LT4 D
2
PAK 800 Tape & Reel
NTB45N06LT4G D
2
PAK
(Pb−Free)
800 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
