IRF1607PBF

Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 142
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 100 A
I
DM
Pulsed Drain Current 570
P
D
@T
C
= 25°C Power Dissipation 380 W
Linear Derating Factor 2.5 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 1250 mJ
I
AR
Avalanche Current See Fig.12a, 12b, 15, 16 A
E
AR
Repetitive Avalanche Energy mJ
dv/dt Peak Diode Recovery dv/dt 5.2 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting Torque, 6-32 or M3 screw 10 lbf•in (1.1N•m)
HEXFET
®
Power MOSFET
This Stripe Planar design of HEXFET
®
Power MOSFETs
utilizes the lastest processing techniques to achieve
extremely low on-resistance per silicon area. Additional
features of this HEXFET power MOSFET are a 175°C
junction operating temperature, fast switching speed
and improved repetitive avalanche rating. These benefits
combine to make this design an extremely efficient and
reliable device for use in a wide variety of applications.
S
D
G
Absolute Maximum Ratings
V
DSS
= 75V
R
DS(on)
= 0.0075
I
D
= 142A
Description
09/22/10
www.irf.com 1
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
Benefits
TO-220AB
IRF1607PbF
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.40
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
R
θJA
Junction-to-Ambient ––– 62
Thermal Resistance
Typical Applications
Industrial Motor Drive
PD -95487A
IRF1607PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 75 ––– ––– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.086 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– 0.00580.0075 V
GS
= 10V, I
D
= 85A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= 10V, I
D
= 250µA
g
fs
Forward Transconductance 79 ––– ––– S V
DS
= 25V, I
D
= 85A
––– ––– 20
µA
V
DS
= 75V, V
GS
= 0V
––– ––– 250 V
DS
= 60V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 200 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -200
nA
V
GS
= -20V
Q
g
Total Gate Charge –– 210 320 I
D
= 85A
Q
gs
Gate-to-Source Charge ––– 45 68 nC V
DS
= 60V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 73 110 V
GS
= 10V
t
d(on)
Turn-On Delay Time ––– 22 ––– V
DD
= 38V
t
r
Rise Time ––– 130 –– I
D
= 85A
t
d(off)
Turn-Off Delay Time –– 84 –– R
G
= 1.8
t
f
Fall Time ––– 86 ––– V
GS
= 10V
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 7750 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 1230 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance –– 310 ––– ƒ = 1.0MHz, See Fig. 5
C
oss
Output Capacitance ––– 5770 ––– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 790 ––– V
GS
= 0V, V
DS
= 60V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 1420 ––– V
GS
= 0V, V
DS
= 0V to 60V
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 85A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 130 200 ns T
J
= 25°C, I
F
= 85A
Q
rr
Reverse RecoveryCharge ––– 690 1040 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
142
570
A
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
Starting T
J
= 25°C, L = 0.21mH
R
G
= 25, I
AS
= 85A, V
GS
=10V (See Figure 12).
I
SD
85A, di/dt 310A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 400µs; duty cycle 2%.
Notes:
C
oss
eff. is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 75A.
Limited by T
Jmax
, see Fig.12a, 12b, 15, 16 for typical repetitive
avalanche performance.
IRF1607PbF
www.irf.com 3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
1000
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V = 25V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
142A
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
4.5V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V

IRF1607PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 75V 142A 7.5mOhm 210nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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