MC74VHC74
http://onsemi.com
2
SD1
CP1
D1
RD1
11
12
13
14
8
9
105
4
3
2
1
7
6
SD2
CP2
D2
RD2
V
CC
Q2
Q2
GND
Q1
Q1
Figure 2. PIN ASSIGNMENT
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
DC Supply Voltage – 0.5 to + 7.0 V
V
in
DC Input Voltage – 0.5 to + 7.0 V
V
out
DC Output Voltage – 0.5 to V
CC
+ 0.5 V
I
IK
Input Diode Current −20 mA
I
OK
Output Diode Current ±20 mA
I
out
DC Output Current, per Pin ±25 mA
I
CC
DC Supply Current, V
CC
and GND Pins ±50 mA
P
D
Power Dissipation in Still Air, SOIC Packages†
TSSOP Package†
500
450
mW
T
stg
Storage Temperature –65 to +150
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage 2.0 5.5 V
V
in
DC Input Voltage 0 5.5 V
V
out
DC Output Voltage 0 V
CC
V
T
A
Operating Temperature, All Package Types −55 + 125
_C
t
r
, t
f
Input Rise and Fall Time V
CC
= 3.3V ±0.3V
V
CC
=5.0V ±0.5V
0
0
100
20
ns/V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND v (V
in
or V
out
) v V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.