SI3447CDV-T1-GE3

Vishay Siliconix
Si3447CDV
Document Number: 69784
S-09-0660-Rev. B, 20-Apr-09
www.vishay.com
1
P-Channel 12-V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
- 12
0.036 at V
GS
= - 4.5 V
- 7.8
12 nC
0.050 at V
GS
= - 2.5 V
- 6.6
0.068 at V
GS
= - 1.8 V
- 5.6
(4) S
(3) G
(1, 2, 5, 6) D
TSOP-6
Top View
6
4
1
2
3
5
Ordering Information: Si3447CDV-T1-E3 (Lead (Pb)-free)
Si3447CDV-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
3 mm
2.85 mm
Marking Code
AO XXX
Lot Traceability
and Date Code
Part # Code
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under Steady State conditions is 110 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 12
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 7.8
A
T
C
= 70 °C
- 6.2
T
A
= 25 °C
- 6.3
b, c
T
A
= 70 °C
- 5.0
b, c
Pulsed Drain Current
I
DM
- 20
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 2.5
T
A
= 25 °C
- 1.67
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
3.0
W
T
C
= 70 °C
2.0
T
A
= 25 °C
2.0
b, c
T
A
= 70 °C
1.3
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 5 s
R
thJA
55 62.5
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
34 41
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
PWM Optimized
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch
PA Switch
www.vishay.com
2
Document Number: 69784
S-09-0660-Rev. B, 20-Apr-09
Vishay Siliconix
Si3447CDV
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 12 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 15
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
2.5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.4 - 1.0 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 12 V, V
GS
= 0 V
- 1
µA
V
DS
= - 12 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 4.5 V
- 20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 6.3 A
0.03 0.036
Ω
V
GS
= - 2.5 V, I
D
= - 5.3 A
0.041 0.050
V
GS
= - 1.8 V, I
D
= - 1.5 A
0.055 0.068
Forward Transconductance
a
g
fs
V
DS
= - 6 V, I
D
= - 6.3 A
20 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 6 V, V
GS
= 0 V, f = 1 MHz
910
pFOutput Capacitance
C
oss
260
Reverse Transfer Capacitance
C
rss
220
Total Gate Charge
Q
g
V
DS
= - 6 V, V
GS
= - 8 V, I
D
= - 6.3 A
20 30
nC
V
DS
= - 6 V, V
GS
= - 4.5 V, I
D
= - 6.3 A
12 18
Gate-Source Charge
Q
gs
1.6
Gate-Drain Charge
Q
gd
3.4
Gate Resistance
R
g
f = 1 MHz 6 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 6 V, R
L
= 1.2 Ω
I
D
- 5 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
20 30
ns
Rise Time
t
r
40 60
Turn-Off Delay Time
t
d(off)
35 55
Fall Time
t
f
20 30
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 6 V, R
L
= 1.2 Ω
I
D
- 5 A, V
GEN
= - 8 V, R
g
= 1 Ω
10 15
Rise Time
t
r
15 25
Turn-Off Delay Time
t
d(off)
35 55
Fall Time
t
f
15 25
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 2.5
A
Pulse Diode Forward Current
a
I
SM
- 20
Body Diode Voltage
V
SD
I
S
= - 5 A
- 0.8 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
35 55 ns
Body Diode Reverse Recovery Charge
Q
rr
20 30 nC
Reverse Recovery Fall Time
t
a
16
ns
Reverse Recovery Rise Time
t
b
19
Document Number: 69784
S-09-0660-Rev. B, 20-Apr-09
www.vishay.com
3
Vishay Siliconix
Si3447CDV
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
4
8
12
16
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=5V thru 2 V
V
GS
=1V
V
GS
=1.5V
0
0.02
0.04
0.06
0.08
0.10
0.12
0.14
048 12 16 20
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
=1.8V
V
GS
=2.5V
V
GS
=4.5V
0
2
4
6
8
0 5 10 15 20 25
I
D
=6.3A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=9.6V
V
DS
=6V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
0.0 0.5 1.0 1.5 2.0
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= - 55 °C
T
C
= 125 °C
C
rss
0
300
600
900
1200
1500
1800
036912
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
R
DS(on)
- On-Resistance
I
D
=6.3A
V
GS
=4.5V,2.5V,1.8V

SI3447CDV-T1-GE3

Mfr. #:
Manufacturer:
Vishay
Description:
MOSFET P-CH 12V 7.8A 6-TSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet