TSM3911DCX6 RFG

TSM3911D
20V Dual P-Channel MOSFET
Document Number:
DS_P0000083 1
Version: D15
SOT
-
26
Key Parameter Performance
Parameter Value
Unit
V
DS
-20 V
R
DS(on)
(max)
V
GS
= -4.5V
140
m
V
GS
= -2.5V
200
V
GS
= -1.8V
300
Q
g
15.23 nC
Features
Advance Trench Process Technology
High Density Cell Design for Ultra Low On-resistance
Block Diagram
Dual P-Channel MOSFET
Ordering Information
Part No. Package
Packing
TSM3911DCX6 RFG SOT-26 3kpcs / 7” Reel
Note:
“G” denotes for Halogen- and Antimony-free as those which contain
<900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds
Absolute Maximum Ratings
(T
A
=25°C unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
-20 V
Gate-Source Voltage V
GS
±8 V
Continuous Drain Current I
D
-2.2 A
Pulsed Drain Current I
DM
-8 A
Continuous Source Current (Diode Conduction)
(Note 1,2)
I
S
-0.72 A
Maximum Power Dissipation
T
A
= 25°C
P
D
1.15
W
T
A
=70°C 0.73
Operating Junction Temperature T
J
+150 °C
Operating Junction and Storage Temperature Range T
J
, T
STG
- 55 to +150 °C
Thermal Performance
Parameter Symbol Limit Unit
Junction to Case Thermal Resistance RӨ
JC
30 °C/W
Junction to Ambient Thermal Resistance (PCB mounted) RӨ
JA
80 °C/W
Pin
Definition
:
1. Gate 1 6. Drain 1
2. Source 2 5. Source 1
3. Gate 2 4. Drain 2
TSM3911D
20V Dual P-Channel MOSFET
Document Number:
DS_P0000083 2
Version: D15
Electrical Specifications
Parameter Conditions Symbol
Min Typ Max Unit
Static
(Note 3)
Drain-Source Breakdown Voltage V
GS
= 0V, I
D
= -250µA BV
DSS
-20 -- --
V
Gate Threshold Voltage V
DS
= V
GS
, I
D
= -250µA V
GS(TH)
-0.45 -- -0.95
V
Gate Body Leakage V
GS
= ±8V, V
DS
= 0V I
GSS
-- -- ±100
nA
Zero Gate Voltage Drain Current V
DS
= -16V, V
GS
= 0V I
DSS
-- -- -1.0
µA
On-State Drain Current V
DS
=-5V, V
GS
= -5V I
D(ON)
-5 -- --
A
Drain-Source On-State Resistance
V
GS
= -4.5V, I
D
= -2.2A
R
DS(ON)
-- 115 140
m
V
GS
= -2.5V, I
D
= -1.8A -- 163 200
V
GS
= -1.8V, I
D
= -1A -- 220 300
Forward Transconductance V
DS
= -5V, I
D
= -2.2A g
fs
-- 5 --
S
Diode Forward Voltage I
S
= -1.05A, V
GS
= 0V V
SD
-- - 0.8 -1.2 V
Dynamic
(Note 4)
Total Gate Charge
V
DS
= -6V, I
D
= -2.8A,
V
GS
= -4.5V
Q
g
-- 15.23
--
nC
Gate-Source Charge Q
gs
-- 5.49 --
Gate-Drain Charge Q
gd
-- 2.74 --
Input Capacitance
V
DS
= -6V, V
GS
= 0V,
f = 1.0MHz
C
iss
-- 882.51
--
pF
Output Capacitance C
oss
-- 145.54
--
Reverse Transfer Capacitance C
rss
-- 97.26
--
Switching
(Note 4,5)
Turn-On Delay Time
V
DD
= -6V, R
L
= 6,
I
D
= -1A, V
GEN
= -4.5V,
R
G
= 6
t
d(on)
--
17.28
--
ns
Turn-On Rise Time t
r
-- 3.73 --
Turn-Off Delay Time t
d(off)
-- 36.05
--
Turn-Off Fall Time t
f
-- 6.19 --
Notes:
1. Pulse width limited by the Maximum junction temperature
2. Surface Mounted on FR4 Board, t 5 sec.
3. pulse test: PW 300µS, duty cycle 2%
4. For DESIGN AID ONLY, not subject to production testing.
5. Switching time is essentially independent of operating temperature.
TSM3911D
20V Dual P-Channel MOSFET
Document Number:
DS_P0000083 3
Version: D15
Electrical Characteristics Curves
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage

TSM3911DCX6 RFG

Mfr. #:
Manufacturer:
Taiwan Semiconductor
Description:
MOSFET Dual 20V P channel Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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