DMG4407SSS
Document number: DS35540 Rev. 6 - 2
2 of 6
www.diodes.com
September 2013
© Diodes Incorporated
DMG4407SSS
NEW PRODUCT
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
-30 V
Gate-Source Voltage
V
GSS
±25 V
Continuous Drain Current (Note 6) V
GS
= -20V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-9.9
-7.9
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-12.5
-10.0
A
Continuous Drain Current (Note 6) V
GS
= -6V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-8.2
-6.5
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-11.0
-8.7
A
Maximum Continuous Body Diode Forward Current (Note 6)
I
S
3.0 A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
-80 A
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
P
D
1.45 W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
R
JA
88 °C/W
t<10s 50 °C/W
Total Power Dissipation (Note 6)
P
D
1.82 W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
R
JA
70 °C/W
t<10s 41 °C/W
Thermal Resistance, Junction to Case (Note 6)
R
JC
7.6 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-50 to 155 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-30 — — V
V
GS
= 0V, I
D
= -250A
Zero Gate Voltage Drain Current
I
DSS
— —
-1 A
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— —
±10 A
V
GS
= ±25V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS
th
-1.7 — -3.0 V
V
DS
= V
GS
, I
D
= -250A
Static Drain-Source On-Resistance
R
DS (ON)
—
9 11
m
V
GS
= -20V, I
D
= 12A
—
10 13
V
GS
= -10V, I
D
= 10A
—
12.7 17
V
GS
= -6V, I
D
= 10A
Forward Transfer Admittance
|Y
fs
|
—
21 — S
V
DS
= -5V, I
D
= -10A
Diode Forward Voltage
V
SD
—
-0.7 -1.0 V
V
GS
= 0V, I
S
= -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
—
2246
—
pF
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
—
352
—
pF
Reverse Transfer Capacitance
C
rss
—
294
—
pF
Gate resistance
R
—
5.1
—
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= 4.5V) Q
—
20.5
—
nC
V
GS
= -10V, V
DS
= -15V,
I
D
= -12A
Total Gate Charge (V
GS
= 10V) Q
—
41
—
nC
Gate-Source Charge
Q
s
—
7.6
—
nC
Gate-Drain Charge
Q
d
—
8.0
—
nC
Turn-On Delay Time
t
D
on
—
11.3
—
ns
V
DD
= -15V, V
GS
= -10V,
R
L
= 1.25, R
G
= 3,
Turn-On Rise Time
t
—
15.4
—
ns
Turn-Off Delay Time
t
D
off
—
38.0
—
ns
Turn-Off Fall Time
t
f
—
22.0
—
ns
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.