Philips Semiconductors
PSMN004-36P/36B
N-channel enhancement mode field-effect transistor
Product data Rev. 01 — 19 November 2001 4 of 13
9397 750 08621
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
7. Thermal characteristics
7.1 Transient thermal impedance
Table 4: Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-mb)
thermal resistance from junction to mounting
base
Figure 4 0.65 K/W
R
th(j-a)
thermal resistance from junction to ambient vertical in still air; SOT78 package 60 K/W
mounted on a printed circuit board;
minimum footprint; SOT404 package
50 K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
03ag43
10
-3
10
-2
10
-1
1
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
t
p
(s)
Z
th j-mb
(K/W)
single pulse
δ = 0.5
0.2
0.1
0.05
0.02
t
p
t
p
T
P
t
T
δ =
Philips Semiconductors
PSMN004-36P/36B
N-channel enhancement mode field-effect transistor
Product data Rev. 01 — 19 November 2001 5 of 13
9397 750 08621
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
8. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage I
D
= 0.25 mA; V
GS
=0V
T
j
=25°C36−−V
T
j
= 55 °C32−−V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
; Figure 9
T
j
=25°C 1 1.5 2 V
T
j
= 175 °C 0.5 −−V
T
j
= 55 °C −−2.3 V
I
DSS
drain-source leakage current V
DS
= 30 V; V
GS
=0V
T
j
=25°C 0.05 10 µA
T
j
= 175 °C −−500 µA
I
GSS
gate-source leakage current V
GS
= ±10 V; V
DS
=0V 1 100 nA
R
DSon
drain-source on-state resistance V
GS
=5V; I
D
=25A;Figure 7 and 8
T
j
=25°C 45m
T
j
= 175 °C −−9.25 m
V
GS
= 4.5 V; I
D
= 25 A; Figure 7 and 8
T
j
=25°C −−5.4 m
V
GS
= 10 V; I
D
= 25 A; Figure 7 and 8
T
j
=25°C 3.5 4 m
Dynamic characteristics
Q
g(tot)
total gate charge I
D
= 75 A; V
DD
=15V; V
GS
=5V;Figure 13 97 nC
Q
gs
gate-source charge 20 nC
Q
gd
gate-drain (Miller) charge 39 nC
C
iss
input capacitance V
GS
=0V; V
DS
= 20 V; f = 1 MHz; Figure 11 6000 pF
C
oss
output capacitance 1700 pF
C
rss
reverse transfer capacitance 1400 pF
t
d(on)
turn-on delay time V
DD
=15V; R
D
= 1.2 ; V
GS
=5V; R
G
=6;
resistive load
45 ns
t
r
turn-on rise time 220 ns
t
d(off)
turn-off delay time 435 ns
t
f
turn-off fall time 320 ns
Source-drain diode
V
SD
source-drain (diode forward) voltage I
S
= 25 A; V
GS
=0V;Figure 12 0.85 1.2 V
V
SD
source-drain (diode forward) voltage I
S
= 75 A; V
GS
=0V;Figure 12 1.1 V
t
rr
reverse recovery time I
S
= 20 A; dI
S
/dt = 100 A/µs; V
GS
=0V 400 ns
Q
r
recovered charge 1 −µC
Philips Semiconductors
PSMN004-36P/36B
N-channel enhancement mode field-effect transistor
Product data Rev. 01 — 19 November 2001 6 of 13
9397 750 08621
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
T
j
=25°CT
j
=25°C and 175 °C; V
DS
> I
D
x R
DSON
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
T
j
=25°C
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
03ag45
0
20
40
60
80
0 0.2 0.4 0.6 0.8 1
V
DS
(V)
I
D
(A)
2.4 V
T
j
= 25 ºC
V
GS
= 2 V
2.8 V
2.6 V
10 V
2.2 V
5 V
03ag47
0
20
40
60
80
-0.2 0.6 1.4 2.2 3
V
GS
(V)
I
D
(A)
V
DS
> I
D
x R
DS(ON)
T
j
= 25 ºC
175 ºC
03ag46
0
0.002
0.004
0.006
0.008
0.01
0 20406080
I
D
(A)
R
DS(on)
()
V
GS
= 2.6VT
j
= 25 ºC
10 V
5 V
2.8 V
03aa27
0
0.4
0.8
1.2
1.6
2
-60 0 60 120 180
T
j
(
o
C)
a
a
R
DSon
R
DSon 25 C
°
()
-----------------------------
=

PSMN004-36B,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
MOSFET N-CH 36V 75A D2PAK
Lifecycle:
New from this manufacturer.
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