Networking
Servers
Switches
Routers
Commercial
Vending machines
Cash registers
Card swipes
Consumer
Set top boxes
Home security
Web TV
Gaming devices
Ofce
Printers
Photocopiers
Desktops & laptops
Medical
Home analysis monitors
Bed monitors
Breathing devices
Industrial
Control units
Vision systems
Security systems
Test equipment
Network Switch
Commercial
MedicalConsumer
Vertical SMT Jack with
Polyimide lm
Vertical SMT Modular Jacks with Polyimide lm
for vacuum pick-and-place functionality can
streamline high-volume PCB production and lower
manufacturing costs
Automatic vacuum pick-and-place is the most common high-speed
manufacturing process for precision placement of surface mount (SMT)
components on printed circuit boards (PCBs) in mass production. The
addition of Polyimide lm to the surface of vertical SMT modular jacks
facilitates automatic vacuum pick-and-place of the connector alongside
other SMT components. This streamlines high-volume production and
lowers manufacturing costs for customers. For additional information on
Molex’s complete offering of modular jacks visit:
www.molex.com/product/modjacks.html
Applications
SMT vertical mounting with added
Polyimide lm
Polyimide lm remains stable across
a wide range of temperatures
Low-prole versions (series 85513)
available
RJ-11 and RJ-45 jacks available
50µ” Gold plating options
Palladium nickel (PdNi) + gold (Au)
ash plating option
Automatic vacuum placement
possible; lowers customer
manufacturing costs
Suitable for high-temperature SMT
manufacturing; Polyimide lm will
keep its form, bond and integrity
Allows for tight board stacking
Provides exibility for variety of
design applications
Meets FCC68.5, IEC60603-7 and
is approved for all FCC and IEC
licenses applications
Achieves 2500 mating cycles; meets
the new durability requirement
of IEC60603-7 PL 2 and FCC68.5
standards
Features and Benets
Vertical SMT
Modular Jacks with
Polyimide Film
85510 Top Entry SMT Jacks
85513 Low Prole, Top Entry
SMT Jacks
