NCP3335A
http://onsemi.com
4
PIN FUNCTION DESCRIPTION
Fixed Version
Micro8
Pin No.
DFN10
Pin No.
Pin Name Description
1, 2 1, 2 V
out
Regulated output voltage. Bypass to ground with C
out
w 1.0 mF.
3 3 SENSE For output voltage sensing, connect to Pins 1 and 2.
4 4 GND Power Supply Ground
5 7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise.
6 8 SD Shutdown pin. When not in use, this pin should be connected to the input pin.
7, 8 9, 10 V
in
Power Supply Input Voltage
− 5, 6 NC Not Connected
− EPAD EPAD Exposed thermal pad should be connected to ground.
Adjustable Version
1, 2 1, 2 V
out
Regulated output voltage. Bypass to ground with C
out
w 1.0 mF.
3 3 Adj Adjustable pin; reference voltage = 1.25 V.
4 4 GND Power Supply Ground
5 7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise.
6 8 SD Shutdown pin. When not in use, this pin should be connected to the input pin.
7, 8 9, 10 V
in
Power Supply Input Voltage
− 5, 6 NC Not Connected
− EPAD EPAD Exposed thermal pad should be connected to ground.
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage V
in
−0.3 to +16 V
Output Voltage V
out
−0.3 to V
in
+0.3 or 10 V* V
Shutdown Pin Voltage V
sh
−0.3 to +16 V
Junction Temperature Range T
J
−40 to +150 °C
Storage Temperature Range T
stg
−50 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) JESD 22−A114−B
Machine Model (MM) JESD 22−A115−A
*Which ever is less. Reverse bias protection feature valid only if V
out
− V
in
≤ 7 V.
THERMAL CHARACTERISTICS
Characteristic
Test Conditions (Typical Value)
Unit
Min Pad Board (Note 1) 1, Pad Board (Note 1)
Micro 8
Junction−to−Air, qJA
264 174 °C/W
Junction−to−Pin, yJL2
110 100 °C/W
10 Lead DFN EPad
Junction−to−Air, qJA
215 66 °C/W
Junction−to−Pin, yJL2
55 17 °C/W
1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and
heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions
are under natural convection or zero air flow.