LQM21PNR24MEHD Datasheet LQM21PNR24MEHD | P1-P3

Spec No. JELF243B-0070-01

P.1/8

MURATA MFG. CO., LTD.

Reference

Only

CHIP COIL (CHIP INDUCTORS) LQM21PN□□□□EHD REFERENCE SPECIFICATION

1. Scope

This reference specification applies to LQM21PN□□□□EH, Chip Coil (Chip Inductors).

2. Part Numbering

(ex) LQ M 21 P N 1R0 M E H D

Product ID Struture Dimension Applications Category Inductance Tolerance Dimension Other Packaging

(L×W) and (T)

D: Taping

Characteristics

B: Bulk

*Bulk p

acking also available. (A product is put in the plastic bag under the taping conditions.)

3. Rating

・Operating Temperature Range －４０℃ to ＋８５℃

・Storage Temperature Range －４０℃ to ＋８５℃

Customer

Part Number

MURATA Part

Number

Inductance

Resistance

(m ohm)

Self

Resonant

Frequency

(MHz min.)

*3 Rated Current(A)

(μH)

Tolerance

(%)

*1 (Based on

Inductance change)

*2(Based on

Temper

ature rise)

Typ Max Typ Max Typ Max

LQM21PN

R24MEHD

0.24

±20%

40 50 130 3.1 2.8 2.9 2.4

LQM21PNR47MEHD

0.47 60 75 80 1.8 1.5 2.4 1.9

LQM21PN1R0MEHD

1.0 85 107 50 1 0.8 2 1.6

LQM21PN1R5MEHD

1.5 100 125 40 0.55 0.4 1.8 1.5

LQM21PN2R2MEHD

2.2 175 219 30 0.45 0.3 1.4 1.1

*1: When applied Rated current to the Products, Inductance will be within ±30% of initial inductance value range.

*2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to 40℃ max.

*3: Keep the temperature (ambient temperature plus self-generation of heat) under 125℃.

4. Testing Conditions

《Unless otherwise specified》《In case of doubt》

Temperature : Ordinary Temperature / 15°C to 35°C Temperature

: 20°C ± 2°C

Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106kPa

5. Appea

rance and Dimensions

■

Unit Mass (Typical value)

0.010g

(in mm)

0.7±0.1

0.5±0.2

2.0±0.15

1.25±0.15

Spec No. JELF243B-0070-01 P.2/8

MURATA MFG. CO., LTD.

Reference

Only

6. Electrical Performance

No. Item Specification Test Method

6.1 Inductance

Meet item 3. Measuring Equipment:

Agilent 4294A or equivalent

(1mA)

Measuring Frequency: 1MHz

6.2 DC Resistance Measuring Equipment: Digital multi meter

DC resistance shall be measured after

putting chip coil between the terminal 2

under the condition of opening between

a and b.

Every measurement the terminal 1 shall

be shorted between a and b when

changing chip coil.

6.3 Self Resonant

Frequency (S.R.F)

Measuring Equipment:

Agilent 4294A or equivalent

7. Mechanical Performance

No. Item Specification Test Method

7.1 Shear Test Chip coil shall not be damaged after

tested as follows.

Applied Direction

Force: 10N

Hold Duration: 5s±1s

Applied Direction: Parallel to PCB

7.2 Bending Test

Appearance: No damage Substrate: Glass-epoxy substrate

(100mm×40mm×1.0mm)

(in mm)

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 30 s

Chip Coil

Substrate

R230

Pressure jig

Deflection

Product

Digital multi meter

(TR6846 or equivalent)

terminal2terminal1

Spec No. JELF243B-0070-01 P.3/8

MURATA MFG. CO., LTD.

Reference

Only

No. Item Specification Test Method

7.3 Vibration Appearance: No damage Oscillation Frequency:

10Hz to 2000Hz to 10Hz for 20 min

Total amplitude 3.0 mm or Acceleration

amplitude 245m/s

whichever is smaller.

Testing Time:

A period of 4h in each of 3 mutually

perpendicular directions.

7.4 Drop

It shall be dropped on concrete or steel

board.

Method : free fall

Height : 1m

Total of 10 cycles

7.5 Solderability The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 240°C±5°C

Immersion Time: 3s±1s

7.6 Resistance to

Soldering Heat

Appearance: No damage

Inductance Change: within ±30%

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 270°C±5°C

Immersion Time: 10s±1s

Then measured after exposure in the room

condition for 24h±2h.

8. Environmental Performance

It shall be soldered on the substrate.

No. Item Specification Test Method

8.1 Heat Resistance

Appearance: No damage

Inductance Change: within ±30%

Temperature: 85°C±2°C

Time: 1000h (+48h, -0h)

Then measured after exposure in the room

condition for 24h±2h.

8.2 Cold Resistance Temperature: -40°C±2°C

Time: 1000h (+48h, -0h)

Then measured after exposure in the room

condition for 24h±2h.

8.3 Humidity Temperature: 40°C±2°C

Humidity: 90%(RH) to 95%(RH)

Time: 1000h (+48h, -0h)

Then measured after exposure in the room

condition for 24h±2h.

8.4 Temperature

Cycle

1 cycle:

1 step: -40°C±2°C / 30 min±3 min

2 step: Ordinary temp. / 10 min to 15 min

3 step: 85°C±2°C / 30 min to 3 min

4 step: Ordinary temp. / 10 min to15 min

Total of 100cycles

Then measured after exposure in the room

condition for 24h±2h.

P1-P3 P4-P6 P7-P8

LQM21PNR24MEHD

Mfr. #:

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LQM21PNR24MEHD