NCP177
www.onsemi.com
2
Figure 2. Internal Block Diagram
IN
EN
OUT
GND
VOLTAGE REFERENCE
AND
SOFT−START
0.7 V
THERMAL
SHUTDOWN
VOLTAGE REFERENCE
AND
SOFT−START
0.7 V
THERMAL
SHUTDOWN
NCP177A (with active discharge) NCP177B (without active discharge)
IN
EN
OUT
GND
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 OUT Regulated output voltage pin
2 GND Power supply ground pin
3 EN Enable pin (active “H”)
4 IN Power supply input voltage pin
− EPAD Exposed pad should be tied to ground plane for better power dissipation
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) IN −0.3 to 6.0 V
Output Voltage OUT −0.3 to VIN + 0.3 V
Chip Enable Input EN −0.3 to 6.0 V
Output Current I
OUT
Internally Limited mA
Maximum Junction Temperature T
J(MAX)
150 °C
Storage Temperature T
STG
−55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESD
HBM
2000 V
ESD Capability, Machine Model (Note 2) ESD
MM
200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per JESD22−A114
ESD Machine Model tested per JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, XDFN4 (Note 3)
Thermal Resistance, Junction−to−Air
R
q
JA
223 °C/W
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
