SI4214DDY-T1-E3

Vishay Siliconix
Si4214DDY-T1-E3
Document Number: 67907
S11-0653-Rev. A, 11-Apr-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Dual N-Channel 30 V (D-S) MOSFET
FEATURES
TrenchFET

Power MOSFET
100 % R
g
Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Notebook System Power
Low Current DC/DC
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()
I
D
(A)
a
Q
g
(Typ.)
30
0.0195 at V
GS
= 10 V
8.5
7.1
0.023 at V
GS
= 4.5 V
8.6
S
1
D
1
G
1
D
1
S
2
D
2
G
2
D
2
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4214DDY-T1-E3 (Lead (Pb)-free)
N-Channel MOSFET
G
1
D
1
S
1
N-Channel MOSFET
G
2
D
2
S
2
Notes:
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 110 °C/W.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
30
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
8.5
A
T
C
= 70 °C
7.5
T
A
= 25 °C
7.5
b, c
T
A
= 70 °C
5.9
b, c
Pulsed Drain Current I
DM
30
Source-Drain Current Diode Current
T
C
= 25 °C
I
S
2.8
T
A
= 25 °C
1.8
b, c
Pulsed Source-Drain Current I
SM
30
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
10
Single Pulse Avalanche Energy E
AS
5
Maximum Power Dissipation
T
C
= 25 °C
P
D
3.1
W
T
C
= 70 °C
2.0
T
A
= 25 °C
2.0
b, c
T
A
= 70 °C
1.25
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typ. Max. Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
52 62.5
°C/W
Maximum Junction-to-Foot (Drain) Steady-State
R
thJF
30 40
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Document Number: 67907
S11-0653-Rev. A, 11-Apr-11
Vishay Siliconix
Si4214DDY-T1-E3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
3.0
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
I
D
= 250 µA
- 5.2
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.2 2.5 V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, TJ = 55 °C
10
On -State Drain Current
b
I
D(on)
V
DS
= 5 V, V
GS
= 10 V
20 A
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= 10 V, I
D
= 8 A
0.016 0.0195
V
GS
= 4.5 V, I
D
= 5 A
0.019 0.023
Forward Transconductance
b
g
fs
V
DS
= 15 V, I
D
= 8 A
27 S
Dynamic
a
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, I
D
= 1 MHz
660
pFOutput Capacitance
C
oss
140
Reverse Transfer Capacitance
C
rss
86
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 8 A
14.5 22
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 8 A
7.1 11
Gate-Source Charge
Q
gs
1.9
Gate-Drain Charge
Q
gd
2.7
Gate Resistance
R
g
f = 1 MHz 0.5 2.6 5.2
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 3
I
D
5 A, V
GEN
= 4.5 V, R
g
= 1
14 28
ns
Rise Time
t
r
45 80
Turn-Off Delay Time
t
d(off)
18 35
Fall Time
t
f
12 24
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 3
I
D
5 A, V
GEN
= 10 V, R
g
= 1
714
Rise Time
t
r
10 20
Turn-Off Delay Time
t
d(off)
15 30
Fall Time
t
f
714
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
2.8
A
Pulse Diode Forward Current
a
I
SM
30
Body Diode Voltage
V
SD
I
S
= 2 A
0.77 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
17 34 ns
Body Diode Reverse Recovery Charge
Q
rr
918nC
Reverse Recovery Fall Time
t
a
10
nS
Reverse Recovery Rise Time
t
b
7
Document Number: 67907
S11-0653-Rev. A, 11-Apr-11
www.vishay.com
3
Vishay Siliconix
Si4214DDY-T1-E3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
8
16
24
32
40
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
=10V thru 4 V
V
GS
=3V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
0.010
0.014
0.018
0.022
0.026
0.030
0 1020304050
V
GS
=4.5V
V
GS
=10V
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0
2
4
6
8
10
0.0 3.2 6.4 9.6 12.8 16
V
DS
=20V
V
DS
=10V
I
D
= 8 A
V
DS
=15V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
012345
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
C
rss
0
200
400
600
800
1000
061218 24 30
C
iss
C
oss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
I
D
= 8 A
V
GS
=4.5V
V
GS
=10V
T
J
-Junction Temperature (°C)
(Normalized)
- On-ResistanceR
DS(on)

SI4214DDY-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V Vds 20V Vgs SO-8
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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