External Visual
No abnormal exterior appearance Microscope (´10)
Physical Dimensions
Within the specified dimensions Using The calipers
Mechanical Shock
Appearance : No abnormal exterior appearance Three shocks in each direction should be applied along
Capacitance Change : Within ±2.5% or 0.25㎊ 3 mutually perpendicular axes of the test specimen (18 shocks)
whichever is larger
Q, IR : Initial spec.
Vibration
Appearance : No abnormal exterior appearance 5g's for 20min., 12cycles each of 3 orientations,
Capacitance Change : Within ±2.5% or 0.25㎊ Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
whichever is larger and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2,000㎐.
Q, IR : Initial spec.
Resistance to
Appearance : No abnormal exterior appearance
preheating : 150℃ for 60~120 sec.
Solder Heat
Capacitance Change : Within ±2.5% or 0.25㎊
Solder pot : 260±5℃, 10±1sec.
whichever is larger
Q, IR : Initial spec.
ESD
Appearance : No abnormal exterior appearance
AEC-Q200-002 or ISO/DIS10605
Capacitance Change : Within ±2.5% or 0.25㎊
whichever is larger
Q, IR : Initial spec.
Solderability
95% of the terminations is to be soldered
a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃
evenly and continuously
b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃
solder : a solution ethanol and rosin
Electrical
Capacitance : Within specified tolerance
The Capacitance / D.F. should be measured at 25℃,
Characterization
Q : 1,000 min. 1 ㎒ ± 10%, 0.5~5 Vrms
IR(25℃) :
More than 100,000 ㏁ or 1,000 ㏁×㎌ I.R. should be measured with a DC voltage not exceeding
Whichever is smaller Rated Voltage @25℃, @125℃ for 60~120 sec.
IR(125℃) : More than 10,000 ㏁ or 100 ㏁×㎌
Whichever is smaller
Dielectric Strength Dielectric Strength : 200% of the rated voltage for 1~5 seconds
Board Flex
Appearance : No abnormal exterior appearance Bending to the limit, 3 ㎜ for 60 seconds
Capacitance Change : Within ±5% or 0.5㎊
whichever is larger
Terminal
Appearance : No abnormal exterior appearance 18 N, for 60 sec.
Strength(SMD)
Capacitance Change : Within ±2.5% or 0.25
㎊
whichever is larger
Beam Load
Destruction value should be exceed 20 N Beam speed : 0.5±0.05 ㎜/sec
Temperature
C0G
Characteristics
From -55 ℃ to 125 ℃, Capacitance change should be within 0±30ppm/℃
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260 +0/-5℃, 30sec. ), Meet IPC/JEDEC J-STD-020 D Standard
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.
Peak value Duration Wave Velocity
1,500G 0.5ms Half sine 4.7m/sec
Performance Test condition
