AD9726
Rev. B | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
THERMAL RESISTANCE
Parameter With Respect to Rating
DBVDD, AVDD1,
AVDD2
DBGND, AGND1,
AGND2
−0.3 V to 3.6 V
DVDD, CLKVDD,
ACVDD, ADVDD
DGND, CLKGND,
ACGND, ADGND
−0.3 V to 2.8 V
DBGND, AGND1,
AGND2
DBGND, AGND1,
AGND2
−0.3 V to +0.3 V
DGND, CLKGND,
ACGND, ADGND
DGND, CLKGND,
ACGND, ADGND
−0.3 V to +0.3 V
REFIO, FSDAJ AGND1
−0.3 V to AVDD1
+ 0.3 V
IOUTA, IOUTB AGND1
−1.0 V to AVDD1
+ 0.3 V
CLK± CLKGND
−0.3 V to CLKVDD
+ 0.3 V
DB[15:0]±,
DCLK_IN±,
DCLK_OUT±
DBGND
−0.3 V to DBVDD
+ 0.3 V
CSB, SCLK, SDIO,
SDO, RESET, REXT
DBGND
−0.3 V to DBVDD
+ 0.3 V
SDR_EN, SPI_DIS ADGND
−0.3 V to ADVDD
+ 0.3 V
Thermal impedance can be lowered to 23°C/W by soldering the
exposed package pad to an external heat sink (for example, the
internal PCB copper ground plane). However, this is not necessary
for the power dissipation and operating temperature range of
the AD9726.
Table 6. Thermal Resistance
Package Type θ
JA
Unit
80-Lead TQFP_EP Package, Thermally Enhanced 32 °C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.