VCC = 5.0 V,
V
O = 0.6 V
5
4
3
2
1
0
100
80
60
40
20
0
–50 –25 0 25 50 75 100
–50 –25 0 25 50 75 100
1.0 k
R
L = 350
IF = 7.5 mA,
V
CC = 5.0 V
tPHL: RL = 350 , 1.0 k, 4.0 k
4.0 k
tPLH: RL = 4.7 k
tPLH: RL = 1.0 k
tPLH: RL = 350
–50 –25 0 25 50 75 100
I
F = 7.5 mA,
V
CC = 5.0 V
300
250
200
150
100
50
0
tr: RL = 4.7 k
tr: RL = 350
tf: RL = 350 , 1.0 k, 4.0 k
tr: RL = 1.0 k
Ambient Temperature T
A (˚C)
Threshold Input Current IFHL (mA)
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
Ambient Temperature TA (˚C)
Propagation Delay Time tPHL, tPLH (ns)
PROPAGATION DELAY TIME vs.
AMBIENT TEMPERATURE
Ambient Temperature TA (˚C)
Pulse Width Distortion tPHL–tPLH (ns)
PULSE WIDTH DISTORTION vs.
AMBIENT TEMPERATURE
Ambient Temperature TA (˚C)
Switching Time tr, tf (ns)
SWITCHING TIME vs.
AMBIENT TEMPERATURE
Input Current IF (mA)
Propagation Delay Time tPHL, tPLH (ns)
PROPAGATION DELAY TIME vs.
INPUT CURRENT
60
50
40
30
20
10
0
–50 –25 0 25 50 75 100
IF = 7.5 mA,
V
CC = 5.0 V
RL = 4.7 k
R
L = 350
1.0 k
151311975
120
100
80
60
40
20
0
tPLH: RL = 4.7 k
tPLH: RL = 1.0 k
tPHL: RL = 350 , 1.0 k, 4.7 k
tPLH: RL = 350
3
Remark The graphs indicate nominal characteristics.
Data Sheet PN10494EJ04V0DS
7
PS9117
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
Tape Direction
PS9117-F3
PS9117-F4
Outline and Dimensions (Reel)
Packing: 2 500 pcs/reel
100±1.0
φ
13.0±0.2
φ
330±2.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
3.9±0.1
3.45 MAX.
7.4±0.1
0.3±0.05
8.0±0.1
1.5
+0.1
–0
5.5±0.1
12.0±0.2
3.0±0.1
Data Sheet PN10494EJ04V0DS
8
PS9117
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
Peak Temperature (lead part temperature) 350°C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
Data Sheet PN10494EJ04V0DS
9
PS9117

PS9117-A

Mfr. #:
Manufacturer:
CEL
Description:
High Speed Optocouplers 10Mbps H-Spd Digital
Lifecycle:
New from this manufacturer.
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