DATA SHEET HAL202
Micronas Sept. 18, 2014; DSH000159_002EN 9
4.2. Soldering, Welding and Assembly
Please check the Micronas Document "Guidelines for the Assembly of HAL Packages" for further informations about
solderability, welding, assembly, and second-level packaging. The document is available on the Micronas website or
on the service portal.
4.3. Pin Connections
Fig. 4–1: Pin configuration
4.4. Dimensions of Sensitive Area
0.25 mm 0.12 mm (on chip)
4.5. Positions of Sensitive Areas
SOT89B-3 TO92UA-5/6
y 0.95 mm nominal 1.08 mm nominal
A4 0.33 mm nominal 0.30 mm nominal