NCP508
http://onsemi.com
15
PACKAGE DIMENSIONS
WDFN6 1.5x1.5, 0.5P
CASE 511BJ−01
ISSUE B
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.73
6X
0.35
5X
1.80
0.50
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
0.83
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
A
SEATING
PLANE
D
E
0.10 C
A3
A
A1
2X
2X
0.10 C
DIM
A
MIN MAX
MILLIMETERS
0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D
E
e
L
PIN ONE
REFERENCE
0.05 C
0.05 C
A0.10 C
NOTE 3
L2
e
b
B
3
6
6X
1
4
0.05 C
L1
1.50 BSC
1.50 BSC
0.50 BSC
0.40 0.60
--- 0.15
BOTTOM VIEW
L
5X
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
L2
0.50 0.70
TOP VIEW
B
SIDE VIEW
NOTE 4
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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