13
LT1963 Series
1963fc
Table 2. SO-8 Package, 8-Lead SO
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
55°C/W
1000mm
2
2500mm
2
2500mm
2
55°C/W
225mm
2
2500mm
2
2500mm
2
63°C/W
100mm
2
2500mm
2
2500mm
2
69°C/W
Table 3. SOT-223 Package, 3-Lead SOT-223
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
42°C/W
1000mm
2
2500mm
2
2500mm
2
42°C/W
225mm
2
2500mm
2
2500mm
2
50°C/W
100mm
2
2500mm
2
2500mm
2
56°C/W
1000mm
2
1000mm
2
1000mm
2
49°C/W
1000mm
2
0mm
2
1000mm
2
52°C/W
Table 4. FE Package, 16-Lead TSSOP
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
38°C/W
1000mm
2
2500mm
2
2500mm
2
43°C/W
225mm
2
2500mm
2
2500mm
2
48°C/W
100mm
2
2500mm
2
2500mm
2
60°C/W
T Package, 5-Lead TO-220
Thermal Resistance (Junction-to-Case) = 4°C/W
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 4V to 6V, an output current range of 0mA to
500mA and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
where,
I
OUT(MAX)
= 500mA
V
IN(MAX)
= 6V
I
GND
at (I
OUT
= 500mA, V
IN
= 6V) = 10mA
So,
P = 500mA(6V – 3.3V) + 10mA(6V) = 1.41W
APPLICATIO S I FOR ATIO
WUUU
Thermal Considerations
The power handling capability of the device is limited by the
maximum rated junction temperature (125°C). The power
dissipated by the device is made up of two components:
1. Output current multiplied by the input/output voltage
differential: (I
OUT
)(V
IN
– V
OUT
), and
2. GND pin current multiplied by the input voltage:
(I
GND
)(V
IN
).
The GND pin current can be found using the GND Pin
Current curves in the Typical Performance Characteris-
tics. Power dissipation will be equal to the sum of the two
components listed above.
The LT1963 series regulators have internal thermal lim-
iting designed to protect the device during overload
conditions. For continuous normal conditions, the maxi-
mum junction temperature rating of 125°C must not be
exceeded. It is important to give careful consideration to
all sources of thermal resistance from junction to ambi-
ent. Additional heat sources mounted nearby must also
be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 1/16" FR-4 board with one ounce
copper.
Table 1. Q Package, 5-Lead DD
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
23°C/W
1000mm
2
2500mm
2
2500mm
2
25°C/W
125mm
2
2500mm
2
2500mm
2
33°C/W
* Device is mounted on topside
* Device is mounted on topside
* Device is mounted on topside
* Device is mounted on topside
14
LT1963 Series
1963fc
device. If the input is left open circuit or grounded, the ADJ
pin will act like an open circuit when pulled below ground
and like a large resistor (typically 5k) in series with a diode
when pulled above ground.
In situations where the ADJ pin is connected to a resistor
divider that would pull the ADJ pin above its 7V clamp
voltage if the output is pulled high, the ADJ pin input
current must be limited to less than 5mA. For example, a
resistor divider is used to provide a regulated 1.5V output
from the 1.21V reference when the output is forced to 20V.
The top resistor of the resistor divider must be chosen to
limit the current into the ADJ pin to less than 5mA when the
ADJ pin is at 7V. The 13V difference between OUT and ADJ
pins divided by the 5mA maximum current into the ADJ pin
yields a minimum top resistor value of 2.6k.
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled to
ground, pulled to some intermediate voltage, or is left
open circuit. Current flow back into the output will follow
the curve shown in Figure 5.
When the IN pin of the LT1963 is forced below the OUT pin
or the OUT pin is pulled above the IN pin, input current will
typically drop to less than 2µA. This can happen if the
input of the device is connected to a discharged (low
voltage) battery and the output is held up by either a
backup battery or a second regulator circuit. The state of
the SHDN pin will have no effect on the reverse output
current when the output is pulled above the input.
Using a DD package, the thermal resistance will be in the
range of 23°C/W to 33°C/W depending on the copper
area. So the junction temperature rise above ambient will
be approximately equal to:
1.41W(28°C/W) = 39.5°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50°C + 39.5°C = 89.5°C
Protection Features
The LT1963 regulators incorporate several protection
features which make them ideal for use in battery-powered
circuits. In addition to the normal protection features
associated with monolithic regulators, such as current
limiting and thermal limiting, the devices are protected
against reverse input voltages, reverse output voltages
and reverse voltages from output to input.
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal opera-
tion, the junction temperature should not exceed 125°C.
The input of the device will withstand reverse voltages of
20V. Current flow into the device will be limited to less than
1mA (typically less than 100µA) and no negative voltage
will appear at the output. The device will protect both itself
and the load. This provides protection against batteries
that can be plugged in backward.
The output of the LT1963 can be pulled below ground
without damaging the device. If the input is left open circuit
or grounded, the output can be pulled below ground by
20V. For fixed voltage versions, the output will act like a
large resistor, typically 5k or higher, limiting current flow
to typically less than 600µA. For adjustable versions, the
output will act like an open circuit; no current will flow out
of the pin. If the input is powered by a voltage source, the
output will source the short-circuit current of the device
and will protect itself by thermal limiting. In this case,
grounding the SHDN pin will turn off the device and stop
the output from sourcing the short-circuit current.
The ADJ pin of the adjustable device can be pulled above
or below ground by as much as 7V without damaging the
APPLICATIO S I FOR ATIO
WUUU
Figure 5. Reverse Output Current
OUTPUT VOLTAGE (V)
0
REVERSE OUTPUT CURRENT (mA)
3.0
4.0
5.0
8
1963 F05
2.0
1.0
2.5
3.5
4.5
1.5
0.5
0
2
1
3
4
6
9
7
5
10
LT1963
V
OUT
= V
ADJ
T
J
= 25°C
V
IN
= 0V
CURRENT FLOWS
INTO OUTPUT PIN
LT1963-3.3
V
OUT
= V
FB
LT1963-1.5
V
OUT
= V
FB
LT1963-1.8
V
OUT
= V
FB
LT1963-2.5
V
OUT
= V
FB
15
LT1963 Series
1963fc
10VAC AT
115V
IN
10VAC AT
115V
IN
+
+
+
750
+V
+V
+V
+V
+V
1/2
LT1018
1/2
LT1018
LT1006
10k
10k
10k
200k
0.1µF
22µF
1µF
0.033µF
1N4148
1N4148
LT1004
1.2V
750
A1
C1A
C1B
34k*
12.1k*
3.3V
OUT
1.5A
L1
500µH
10000µF
TO ALL “+V”
POINTS
22µF
1N4002
1N4002 1N4002
1N4148
“SYNC”
1k
L2
90-140
VAC
1963 TA03
LT1963-3.3
IN
SHDN
OUT
FB
GND
2.4k
+
+
+
L1 = COILTRONICS CTX500-2-52
L2 = STANCOR P-8559
* = 1% FILM RESISTOR
= NTE5437
TYPICAL APPLICATIO S
U
SCR Pre-Regulator Provides Efficiency Over Line Variations
LT1963-3.3
IN
SHDN
OUT
FB
GND
LT1963
IN
SHDN
OUT
FB
GND
+
+
R1
0.01
R2
0.01
R3
2.2k
R4
2.2k
R5
1k
R6
6.65k
R7
4.12k
C1
100µF
C3
0.01µF
C2
22µF
V
IN
> 3.7V
SHDN
3.3V
3A
8
4
3
2
1
+
1/2
LT1366
1963 TA05
Paralleling of Regulators for Higher Output Current

LT1963EFE-1.8#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LDO Voltage Regulators 1.5A, Fast Transient LDO in FE-16
Lifecycle:
New from this manufacturer.
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