L9349-LF Package information
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4 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
®
packages. ECOPACK
®
packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 9. PowerSO-20 mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
e
a2
A
E
a1
PSO20MEC
DETAIL A
T
D
110
1120
E1
E2
h x 45˚
DETAIL A
lead
slug
a3
S
Gage Plane
0.35
L
DETAIL B
R
DETAIL B
(COPLANARITY)
GC
- C -
SEATING PLANE
e3
b
c
NN
H
BOTTOM VIEW
E3
D1
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A3.60.142
a1 0.1 0.3 0.004 0.012
a2 3.3 0.130
a3 0 0.1 0.000 0.004
b 0.4 0.53 0.016 0.021
c 0.23 0.32 0.009 0.013
D (1) 15.8 16 0.622 0.630
D1 (2
) 9.4 9.8 0.370 0.386
E 13.9 14.5 0.547 0.570
e 1.27 0.050
e3 11.43 0.450
E1 (1) 10.9 11.1 0.429 0.437
E2 2.9 0.114
E3 5.8 6.2 0.228 0.244
G 0 0.1 0.000 0.004
H 15.5 15.9 0.610 0.626
h 1.1 0.043
L 0.8 1.1 0.031 0.043
N 8˚(typ.)
S 8˚(max. )
T 10 0.394
(1) “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions: “E”, “G” and “a3”.
(2)
For subcontractors, the limit is the one quoted in jedec MO-166
PowerSO-20
0056635 I
JEDEC MO-166
Weight: 1.9gr
