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CM1238-08DE

P1-P3P4-P6P7-P9
CM1238
Rev. 2 | Page 4 of 9 | www.onsemi.com
Precision Internal Component Matching
Board designs can take advantage of precision internal
component matching for improved signal integrity, not
otherwise possible with discrete components at the system
level. This simplifies PCB layout considerations and
eliminates associated passive components for load matching
normally required by standard ESD protection circuits.
Each ESD channel consists of a pair of diodes in series
which steer the positive or negative ESD current pulse to
either the Zener diode or to ground. This eliminates the need
for a separate bypass capacitor to absorb positive ESD
strikes. The CM1238 protects against ESD pulses up to
±20kv contact per the IEC 61000-4-2 standard.
Ordering Information
# of Pins Package Ordering Part Number
1
Part Marking
2
16 TDFN CM1238-08DE 1238(yw)
Note 1: Parts are shipped in tape and reel form.
Note 2: (yw) is a 2-character datecode.
Package/Pin Information
Pin Descriptions
Pin Name Description
1 In_1+ Bidrectional Clamp to ASIC (inside system)
2 In_1- Bidrectional Clamp to ASIC (inside system)
3 In_2+ Bidrectional Clamp to ASIC (inside system)
4 In_2- Bidrectional Clamp to ASIC (inside system)
5 In_3+ Bidrectional Clamp to ASIC (inside system)
6 In_3- Bidrectional Clamp to ASIC (inside system)
7 In_4+ Bidrectional Clamp to ASIC (inside system)
8 In_4- Bidrectional Clamp to ASIC (inside system)
9 Out_4- Bidrectional Clamp to Connector (outside system)
10 Out_4+ Bidrectional Clamp to Connector (outside system)
11 Out_3- Bidrectional Clamp to Connector (outside system)
12 Out_3+ Bidrectional Clamp to Connector (outside system)
13 Out_2- Bidrectional Clamp to Connector (outside system)
14 Out_2+ Bidrectional Clamp to Connector (outside system)
15 Out_1- Bidrectional Clamp to Connector (outside system)
16 Out_1+ Bidrectional Clamp to Connector (outside system)
PAD GND Ground return to shield
CM1238
Rev. 2 | Page 5 of 9 | www.onsemi.com
Absolute Maximum Ratings
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85
o
C
Storage Temperature Range -65 to +150
o
C
Breakdown Voltage (Positive) 6 V
Electrical Operating Characteristis
(See Note 1)
SYMBOL
PARAMETER CONDITIONS MIN TYP MAX
UNITS
V
IN
I/O Voltage Relative to GND -0.5 5.5 V
I
IN
Continuous Current through signal pins
(IN to OUT) 1000 Hr
100 mA
I
F
Channel Leakage Current
T
A
= 25
o
C; V
N
= 0V, V
TEST
= 5V
0.1 1.0 µA
V
ESD
ESD Protection - Peak Discharge Voltage
at any channel input, in system:
a) Contact discharge per
IEC 61000-4-2 Standard
b) Air discharge per IEC 61000-4-2
Standard
T
A
= 25
o
C; Note 2
T
A
= 25
o
C; Note 2
±20
±25
kV
kV
I
RES
Residual ESD Peak Current on RDUP
(Resistance of Device Under Protection)
IEC 61000-4-2 8kV;
RDUP = 5Ω, T
A
= 25
o
C;
Note 2
3.8
A
V
CL
Channel Clamp Voltage
(Channel clamp voltage per
IEC 61000-4-5 Standard)
Positive Transients
Negative Transients
I
PP
= 1A, T
A
= 25
o
C,
t
P
= 8/20
µ
s;
Note 2
+10
-1.9
V
V
R
DYN
Dynamic Resistance
Positive Transients
Negative Transients
I
PP
= 1A, T
A
= 25
o
C
t
P
= 8/20
µ
s;
Note 2
2.0
0.7
Ω
Ω
Zo Differential Channels pair characteristic
impedance
T
R
= 200ps;
Note 2
100
Ω
∆Zo
Channel-to-Channel Impedance Match
(Differential)
T
R
= 200ps;
Note 2
2 %
Z
CHANNEL
Individual Channel Characteristic
Impedance in Single-ended Connection
T
R
= 200ps 50
Ω
∆
Z
CHANNEL
Channel-to-Channel Impedance Match
(Individual)
T
R
= 200ps;
Note 2
2 %
Note 1: All parameters specified at T
A
= –40
o
C to +85
o
C unless otherwise noted.
Note 2: This parameter is guaranteed by design and verified by device characterization
CM1238
Rev. 2 | Page 6 of 9 | www.onsemi.com
Performance Information
Graphical Comparison and Test Setup
Figure 4. shows that the CM1238 lowers the peak voltage and clamping voltage by more than 60% across a wide range of
loading conditions in comparison to a standard ESD protection device. Figure 5. also indicates that the DUP/ASIC protected
by the CM1238 dissipates less power than a standard ESD protection device. This data was derived using the test setups
shown in Figure 6.
Figure 4.
Normalized VPeak (8KV IEC-61000 4-2 ESD Contact Strike) vs. Loading (RDUP)*
Figure 5.
Normalized Residual Current into DUP vs. RDUP*
*RDUP is the emulated Dynamic Resistance (load) of the Device Under Protection (DUP). See Figure 6.
P1-P3P4-P6P7-P9

CM1238-08DE

Mfr. #:
Buy CM1238-08DE
Manufacturer:
ON Semiconductor
Description:
ESD Suppressors 8 CH. ESD PROTECTION
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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