© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 5
1 Publication Order Number:
MBRP30060CT/D
MBRP30060CT
POWERTAP II Switch-mode
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a platinum barrier metal.
Features
• Dual Diode Construction May Be Paralleled for Higher Current
Output
• Guardring for Stress Protection
• Low Forward Voltage
• 150°C Operating Junction Temperature
• Pb−Free Package is Available*
Mechanical Characteristics:
• Case: Epoxy, Molded with Metal Heatsink Base
• Weight: 80 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant
• Top Terminal Torque: 25−40 lb−in Max
• Base Plate Torques:
See procedure given in the Package Outline Section
MAXIMUM RATINGS
Rating Symbol Max Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
60 V
Average Rectified Forward Current
(Rated V
R
, T
C
= 140°C) Per Leg
Per Device
I
F(AV)
150
300
A
Peak Repetitive Forward Current,
(Rated V
R
, Square Wave,
20 kHz, T
C
= 140°C) Per Leg
I
FRM
300
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz) Per Leg
I
FSM
2500 A
Peak Repetitive Reverse Current
(2.0 ms, 1.0 kHz) Per Leg
I
RRM
2.0
A
Storage Temperature Range T
stg
−55 to +150 °C
Operating Junction Temperature T
J
−55 to +150 °C
Voltage Rate of Change (Rated V
R
) dv/dt 10,000
V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SCHOTTKY
BARRIER RECTIFIER
300 AMPERES, 60 VOLTS
1
2
3
www.onsemi.com
Device Package Shipping
ORDERING INFORMATION
MBRP30060T
POWERTAP II
25 Units/Tray
POWERTAP II
CASE 357C
PLASTIC
1
2
3
MARKING DIAGRAM
B30060T
B30060T = Specific Device Code
MCC = Mold Compound Code
A = Assembly Location
YY = Year
WW = Work Week
G = Pb−Free Package
MCC
AYYWWG
MBRP30060TG POWERTAP II
(Pb−Free)
25 Units/Tray