Device Selection Guide
Package Dimension (mm)
[1,2]
AlInGaP Green Package Description
1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused
1.6 (L) x 1.0 (W) x 0.6 (H) HSME-C120 Untinted, Non-diffused
3.2 (L) x 1.5 (W) x 1.0 (H) HSME-C110 Untinted, Non-diffused
3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused
3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at T
A
= 25°C
Parameter
HSME-C110/120/170/177/
190/191/197/150/265 Units
DC Forward Current
[1,2]
20 mA
Power Dissipation 52 mW
Reverse Voltage (I
R
= 100 µA)
5 V
LED Junction Temperature 95 °C
Operating Temperature Range –40 to +85 °C
Storage Temperature Range –40 to +85 °C
Soldering Temperature See reflow soldering profile (Figures 6 & 7)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive current above 5 mA is recommended for best long term performance.
Electrical Characteristics at T
A
= 25°C
Part Number
Forward Voltage
V
F
(Volts)
@ I
F
= 20 mA
Reverse Breakdown
V
R
(Volts)
@ I
R
= 100 µA
Capacitance C
(pF), V
F
= 0,
f = 1 MHz
Thermal
Resistance
Rθ
J–PIN
(°C/W)
Typ. Max. Min. Typ. Typ.
HSME-C110/120 2.1 2.6 5 18 550
HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450
HSME-C265 2.1 2.6 5 16 450
