BSH203,215

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Philips Semiconductors Product specification
P-channel enhancement mode BSH203
MOS transistor
FEATURES SYMBOL QUICK REFERENCE DATA
• Very low threshold voltage V
DS
= -30 V
• Fast switching
• Logic level compatible I
D
= -0.47 A
• Subminiature surface mount
package R
DS(ON)
1.1 (V
GS
= -2.5 V)
V
GS(TO)
0.4 V
GENERAL DESCRIPTION PINNING SOT23
P-channel, enhancement mode, PIN DESCRIPTION
logic level, field-effect power
transistor. This device has low 1 gate
threshold voltage and extremely
fast switching making it ideal for 2 source
battery powered applications and
high speed digital interfacing. 3 drain
The BSH203 is supplied in the
SOT23 subminiature surface
mounting package.
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
Drain-source voltage - -30 V
V
DGR
Drain-gate voltage R
GS
= 20 k - -30 V
V
GS
Gate-source voltage - ± 8V
I
D
Drain current (DC) T
a
= 25 ˚C - -0.47 A
T
a
= 100 ˚C - -0.3 A
I
DM
Drain current (pulse peak value) T
a
= 25 ˚C - -1.9 A
P
tot
Total power dissipation T
a
= 25 ˚C - 0.417 W
T
a
= 100 ˚C - 0.17 W
T
stg
, T
j
Storage & operating temperature - 55 150 ˚C
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-a
Thermal resistance junction to FR4 board, minimum 300 - K/W
ambient footprint
d
g
s
1
2
3
Top view
August 1998 1 Rev 1.000
Philips Semiconductors Product specification
P-channel enhancement mode BSH203
MOS transistor
ELECTRICAL CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown V
GS
= 0 V; I
D
= -10 µA -30 - - V
voltage
V
GS(TO)
Gate threshold voltage V
DS
= V
GS
; I
D
= -1 mA -0.4 -0.68 - V
T
j
= 150˚C -0.1 - - V
R
DS(ON)
Drain-source on-state V
GS
= -4.5 V; I
D
= -280 mA - 0.66 0.9
resistance V
GS
= -2.5 V; I
D
= -280 mA - 0.92 1.1
V
GS
= -1.8 V; I
D
= -140 mA - 1.1 1.2
V
GS
= -2.5 V; I
D
= -280 mA; T
j
= 150˚C - 1.4 1.65
g
fs
Forward transconductance V
DS
= -24 V; I
D
= -280 mA 0.3 1.0 - S
I
GSS
Gate source leakage current V
GS
= ±8 V; V
DS
= 0 V - ±10 ±100 nA
I
DSS
Zero gate voltage drain V
DS
= -24 V; V
GS
= 0 V; - -50 -100 nA
current T
j
= 150˚C - -1.3 -10 µA
Q
g(tot)
Total gate charge I
D
= -0.5 A; V
DD
= -10 V; V
GS
= -4.5 V - 2.2 - nC
Q
gs
Gate-source charge - 0.4 - nC
Q
gd
Gate-drain (Miller) charge - 0.25 - nC
t
d on
Turn-on delay time V
DD
= -10 V; I
D
= -0.5 A; - 2 - ns
t
r
Turn-on rise time V
GS
= -8 V; R
G
= 6 - 4.5 - ns
t
d off
Turn-off delay time Resistive load - 45 - ns
t
f
Turn-off fall time - 20 - ns
C
iss
Input capacitance V
GS
= 0 V; V
DS
= -24 V; f = 1 MHz - 110 - pF
C
oss
Output capacitance - 27 - pF
C
rss
Feedback capacitance - 7 - pF
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DR
Continuous reverse drain T
a
= 25 ˚C - - -0.47 A
current
I
DRM
Pulsed reverse drain current - - -1.9 A
V
SD
Diode forward voltage I
F
= -0.38 A; V
GS
= 0 V - -0.87 -1.3 V
t
rr
Reverse recovery time I
F
= -0.5 A; -dI
F
/dt = 100 A/µs; - 27 - ns
Q
rr
Reverse recovery charge V
GS
= 0 V; V
R
= -24 V - 28 - nC
August 1998 2 Rev 1.000

BSH203,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET TAPE7 MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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