Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4111
August 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder Reflow Profile
Temperatu re
t
t
P
t
s
T
C
-5°C
Time 25°C to Peak
Time
25°C
T
smin
T
smax
T
L
T
P
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
S
t
t
a
an
nd
da
a
r
rd
d
S
S
n
nP
P
b
b
S
S
o
ol
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
VolumeVolume
Package mm
3
mm
3
Thickness <350
_
>350
<2.5mm 235°C 220°C
_
>2.5mm 220°C 220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
e
a
ad
d
(
(
P
P
b
b)
)
F
Fr
re
e
e
e
S
S
o
ol
ld
de
e
r
r
(
(
T
T
c
c
)
)
Volume Volume Volume
Package mm
3
mm
3
mm
3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (T
smin
) 100°C 150°C
• Temperature max. (T
smax
) 150°C 200°C
• Time (T
smin
to T
smax
) (t
s
) 60-120 Seconds 60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C 217°C
60-150 Seconds 60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate T
smax
to T
p
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
Peak package body temperature (T
P
)*
Time (t
p
)** within 5 °C of the specified classification temperature (T
c
)
Average ramp-down rate (T
p
to T
smax
)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
* Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Technical Data 4111
Effective August 2017
UP2C
UNI-PAC™ drum core power inductors
