2004 Aug 13 4
NXP Semiconductors Product data sheet
NPN resistor-equipped transistors;
R1 = 22 kΩ, R2 = open
PDTC124T series
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PDTC124TE − plastic surface mounted package; 3 leads SOT416
PDTC124TEF − plastic surface mounted package; 3 leads SOT490
PDTC124TK − plastic surface mounted package; 3 leads SOT346
PDTC124TM − leadless ultra small plastic package; 3 solder lands; body
1.0
× 0.6 × 0.5 mm
SOT883
PDTC124TS − plastic single-ended leaded (through hole) package; 3 leads SOT54
PDTC124TT − plastic surface mounted package; 3 leads SOT23
PDTC124TU − plastic surface mounted package; 3 leads SOT323
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter − 50 V
V
CEO
collector-emitter voltage open base − 50 V
V
EBO
emitter-base voltage open collector − 5 V
I
O
output current (DC) − 100 mA
I
CM
peak collector current − 100 mA
P
tot
total power dissipation T
amb
≤ 25 °C
SOT54 note 1 − 500 mW
SOT23 note 1 − 250 mW
SOT346 note 1 − 250 mW
SOT323 note 1 − 200 mW
SOT490 notes 1 and 2 − 250 mW
SOT883 notes 2 and 3 − 250 mW
SOT416 note 1 − 150 mW
T
stg
storage temperature −65 +150 °C
T
j
junction temperature − 150 °C
T
amb
operating ambient temperature −65 +150 °C
