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LA E6SF-BACA-24-1-ZI

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
LS E6SF, LR E6SF, LA E6SF, LO E6SF, LY E6SF
2010-01-15 13
Empfohlenes Lötpaddesign
verwendbar für TOPLED und Power TOPLED
Reflow Löten
8)
Seite 18
Recommended Solder Pad
useable for TOPLED and Power TOPLED
Reflow Soldering
8) page 18
Empfohlenes Lötpaddesign
8)
Seite 18
Wellenlöten (TTW)
Recommended Solder Pad
8) page 18
TTW Soldering
OHLPY440
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
OHAY1583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
2 (0.079)
1 (0.039)
2.8 (0.110)
0.5 (0.020)
Solder resist
Lötstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2
Cu Fläche / > 16 mm per pad
Cu-area
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Cathode
Kathode/
2010-01-15 14
LS E6SF, LR E6SF, LA E6SF, LO E6SF, LY E6SF
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
CC... 130100
2 K/s
Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
LS E6SF, LR E6SF, LA E6SF, LO E6SF, LY E6SF
2010-01-15 15
Barcode-Produkt-Etikett (BPL)
Barcode-Product-Label (BPL)
Gurtverpackung
Tape and Reel
Tape dimensions in mm (inch)
W P
0
P
1
P
2
D
0
E F
4 ± 0.1
(0.157 ± 0.004)
4 ± 0.1
(0.157 ± 0.004)
2 ± 0.05
(0.079 ± 0.002)
1.5 + 0.1
(0.059 + 0.004)
1.75 ± 0.1
(0.069 ± 0.004)
3.5 ± 0.05
(0.138 ± 0.002)
Reel dimensions in mm (inch)
A W N
min
W
1
W
2 max
180 (7) 8 (0.315) 60 (2.362) 8.4 + 2 (0.331 + 0.079) 14.4 (0.567)
330 (13) 8 (0.315) 60 (2.362) 8.4 + 2 (0.331 + 0.079) 14.4 (0.567)
Sample
OHA12043
X - X - X(G) GROUP:
Lot Number(1T) LOT NO: (9D) D/C: Date Code
(X) PROD NO: Product Code
(6P) BATCH NO: Batch Number
Lx xxxx
Product Name
RoHS Compliant
Bin1: Bin Information Color 1
Bin2:
Bin3:
ML
2
Temp ST
260 C RT
Additional TEXT
R077 DEMY
PACKVAR: Packing Type
Product Quantity per Reel(Q)QTY:
Semiconductors
OSRAM Opto
Wavelength Group
Forward Voltage Group
Brightness Group
Bar Code
Bar Code
Bar Code
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Gurtvorlauf:
Leader:
Trailer:
Gurtende:
13.0
Direction of unreeling
±0.25
160 mm
160 mm
400 mm
400 mm
8
+ 0.3
– 0.1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

LA E6SF-BACA-24-1-ZI

Mfr. #:
Buy LA E6SF-BACA-24-1-ZI
Manufacturer:
Description:
LED AMBER CLEAR 4PLCC SMD
Lifecycle:
New from this manufacturer.
Delivery:
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