TSH150ID

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TSH150
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TEST WAVEFORM EVALUATION CIRCUIT
PRINTED CIRCUIT LAYOUT
As for any high frequency device, a few rules must
be observed when designing the PCB to get the
best performances from this high speed op amp.
From the most to the least important points :
Each power supply lead has to be by-
passed to ground with a 10nF ceramic ca-
pacitor very close to the device and a 10µF
tantalum capacitor.
To provide low inductance and low resist-
ance common return, use a ground plane
or common point return for power and sig-
nal.
All leads must be wide and as short as pos-
sible especially for op amp inputs. This is in
order to decrease parasitic capacitance
and inductance.
Use small resistor values to decrease time
constant with parasitic capacitance.
Choose component sizes as small as pos-
sible (SMD).
On output, decrease capacitor load so as
to avoid circuit stability being degraded
which may cause oscillation. You can also
add a serial resistor in order to minimise its
influence.
One can add in parallel with feedback re-
sistor a few pF ceramic capacitor C
F
adjust-
ed to optimize the settling time.
V
in
50%
t
d
t
r
90%
t
s
0.1% of edge amplitude
10%
Input
50
1k
1k
10nF
10µF
C
F
-5V
+5V
10nF
10
µ
F
50
Output
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MACROMODEL
Applies to: TSH150I
** Standard Linear Ics Macromodels, 1993.
** CONNECTIONS :
* 1 INVERTING INPUT
* 2 NON-INVERTING INPUT
* 3 OUTPUT
* 4 POSITIVEPOWER SUPPLY
* 5 NEGATIVE POWER SUPPLY
.SUBCKT TSH150 1 3 2 4 5 (analog)
********************************************************
.MODEL MDTH D IS=1E-8 KF=1.568191E-15
CJO=10F
* INPUT STAGE
CIP 2 5 1.000000E-12
CIN 1 5 1.000000E-12
EIP 10 5 2 5 1
EIN 16 5 1 5 1
RIP 10 11 1.040000E+02
RIN 15 16 1.040000E+02
RIS 11 15 3.264539E+02
DIP 11 12 MDTH 400E-12
DIN 15 14 MDTH 400E-12
VOFP 12 13 DC -9.162265E-05
VOFN 13 14 DC 0
IPOL 13 5 1.000000E-03
CPS 11 15 5.757255E-12
DINN 17 13 MDTH 400E-12
VIN 17 5 1.5000000e+00
DINR 15 18 MDTH 400E-12
VIP 4 18 0.500000E+00
FCP 4 5 VOFP 2.200000E+01
FCN 5 4 VOFN 2.200000E+01
FIBP 2 5 VOFP 1.000000E-02
FIBN 5 1 VOFN 1.000000E-02
* AMPLIFYING STAGE
FIP 5 19 VOFP 4.370000E+02
FIN 5 19 VOFN 4.370000E+02
RG1 19 5 1.124121E+03
RG2 19 4 1.124121E+03
CC 19 29 2.000000E-09
HZTP 30 29 VOFP 5.574976E+01
HZTN 5 30 VOFN 5.574976E+01
DOPM 19 22 MDTH 400E-12
DONM 21 19 MDTH 400E-12
HOPM 22 28 VOUT 5.000000E+02
VIPM 28 4 5.000000E+01
HONM 21 27 VOUT 5.000000E+02
VINM 5 27 5.000000E+01
EOUT 26 23 19 5 1
VOUT 23 5 0
ROUT 26 3 2.180423E+01
COUT 3 5 1.000000E-12
DOP 19 25 MDTH 400E-12
VOP 4 25 1.511965E+00
DON 24 19 MDTH 400E-12
VON 24 5 1.511965E+00
.ENDS
ELECTRICAL CHARACTERISTICS
V
CC
= ±5V, T
amb
= 25°C (unless otherwise specificed)
Symbol Conditions Value Unit
V
io
0mV
A
vd
R
L
= 100
1V/mV
I
CC
No load 21 mA
V
icm
-3.5 to 4.5 V
V
OH
R
L
= 100
+3.6 V
V
OL
R
L
= 100
-3.6 V
I
sink
V
o
= 0V
108 mA
I
source
V
o
= 0V
108 mA
GBP
R
L
= 100
, C
L
= 15pF
147 MHz
SR
R
L
= 100
, C
L
= 15pF
180 V/
µ
s
φ
m
R
L
= 100
, C
L
= 15pF
42 Degrees
t
s
A
v
= -1 at 0.1%
22.6 ns
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TSH150
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consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support
devices or systems without express written approval of STMicroelectronics.
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PACKAGE MECHANICAL DATA
8 PINS - PLASTIC MICROPACKAGE (SO)
Dim.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 1.75 0.069
a1 0.1 0.25 0.004 0.010
a2 1.65 0.065
a3 0.65 0.85 0.026 0.033
b 0.35 0.48 0.014 0.019
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.020
c1 45° (typ.)
D 4.8 5.0 0.189 0.197
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 3.81 0.150
F 3.8 4.0 0.150 0.157
L 0.4 1.27 0.016 0.050
M 0.6 0.024
S 8° (max.)
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TSH150ID

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC OPAMP GP 150MHZ 8SO
Lifecycle:
New from this manufacturer.
Delivery:
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